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PDF TQP5525 Data sheet ( Hoja de datos )
| Número de pieza | TQP5525 | |
| Descripción | High-Power 5GHz WLAN Power Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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TQP5525
High Power 5 GHz WLAN Power Amplifier
Applications
802.11a/n/ac Wireless LAN Systems
CPE (Set Top Box, Routers, Gateways)
WiFi Access Points and Small Cells
Telematics
Gaming and Infotainment
Point-to-point and Backhaul
ISM Band
4x4 mm 20-pin Leadless QFN Package
Product Features
Fully Integrated 802.11ac Power Amplifier Module
With Power Detector
Internally Matched Input / Output
Temperature Compensated Bias Network
High Gain = 32 dB
Integrated CMOS Compatible Logic and Shutdown
Typ. POUT=+25 dBm Pout, 35 dB EVM,
MCS9/VHT80 802.11ac
Typ. POUT=+18 dBm, EVM=−40 dB,
MCS9/VHT80 802.11ac
Typ. POUT = +26 dBm, EVM = −30 dB,
MCS7/HT40 802.11n
Supply Voltage: +3.3 V to +5.0 V
Leadless 4.0 x 4.0 x 0.85 mm Pb-Free QFN Package
Functional Block Diagram
Pin 1 Reference Mark
20 19 18 17 16
NC 1
GND 2
DC Biasing/
Control Circuit
15 GND
14 GND
RFIN 3
13 RFOUT
GND 4
12 GND
PA_EN 5
11 GND
6 7 8 9 10
Backside Paddle
RF/DC GND
General Description
The TQP5525 is high power WLAN power amplifier
module containing an internally matched 3-stage PA,
compensated DC biasing circuit and output power
detector. This PA module provides high gain (32 dB),
high linearity, industry leading EVM floor, and excellent
spectral purity for wideband OFDM applications. The
architecture and interface are optimized for the most
stringent EVM requirements of next generation 802.11.ac
WLAN devices.
The TQP5525 features chipset logic compatible control
voltages and buffered PA enable pin (PAEN) all of which
draw very low current to facilitate ease of use and
compatibility with current and future transceiver
generations. With its optimized power dissipation, this
amplifier module is well suited for implementation into
next generation MIMO configurations and well designed
to work with or without digital pre-distortion (DPD).
The TQP5525 is assembled in a small footprint 4.0 x 4.0
x 0.85 mm 20-pin QFN package.
Pin Configuration
Pin No.
2, 4, 11, 12, 14, 15, 16, 17
3
5
1, 6, 8
7
9, 18
10
13
19 / 20
Backside Paddle
Label
GND
RFIN
PA_EN
NC
DET_ALT
VCC3
DET
RFOUT
VCC2 / VCC1
RF/DC Ground
Ordering Information
Part No.
Description
TQP5525
High Power 5 GHz WLAN PA
TQP5525-EVB
Evaluation Board
Standard T/R size = 2500 pieces on 13” reel
Datasheet: Rev. F 09-09-15
© 2015 TriQuint Semiconductor, Inc
- 1 of 11 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
1 page  
Performance Plots Vcc= +5 V
TQP5525
High Power 5 GHz WLAN Power Amplifier
Wideband Gain vs. Frequency
40
VCC=+5 V
30
+85°C
+25°C
−40°C
20
10
0
-10
3.8 4.2 4.6 5 5.4 5.8 6.2 6.6 7 7.4 7.8
Frequency (GHz)
Return Loss vs. Frequency
0
VCC=+5 V
Temp.=+25°C
-4
ORL
-8 IRL
-12
-16
-20
4.8 5 5.2 5.4 5.6 5.8 6
Frequency (GHz)
EVM vs. Output Power
-23
-26
802.11.ac 80 MHz MCS9
Packet Length: 60 usec.
Frequency: 5500 MHz
-29 Vcc=+5 V
-32
-35
+85°C
-38 +25°C
-41 −20°C
−40°C
-44
-47
8
10 12 14 16 18 20 22 24 26 28
Output Power
Gain vs. Frequency
45
VCC=+5 V
40
35
+85°C
+25°C
−40°C
30
25
20
15
10
4.8 5 5.2 5.4 5.6 5.8
Frequency (GHz)
6
EVM vs. Output Power
-23
802.11.ac 80 MHz MCS9
-26 Packet Length: 60 usec.
Vcc = +5 V
Temp.=+25°C
-29
-32
-35 5855 MHz
-38 5500 MHz
5210 MHz
-41
-44
-47
8
10 12 14 16 18 20 22 24 26 28
Output Power (dBm)
EVM vs. Output Power
-23
802.11.ac 80 MHz MCS9
-26 Packet Length: 4 msec.
Duty Cycle: 50%
-29 Vcc=+5 V
Temp.=+25°C
-32
5855 MHz
-35 5500 MHz
-38 5210 MHz
-41
-44
-47
8
10 12 14 16 18 20 22 24 26 28
Output Power (dBm)
Datasheet: Rev. F 09-09-15
© 2015 TriQuint Semiconductor, Inc
- 5 of 11 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
5 Page 
TQP5525
High Power 5 GHz WLAN Power Amplifier
Product Compliance Information
ESD Sensitivity Ratings
Caution! ESD-Sensitive Device
ESD Rating: 1C
Value: ≥ 1000 V to < 2000 V
Test: Human Body Model (HBM)
Standard: ESDA/JEDEC Standard JS-001-2012
ESD Rating: C3
Value: ≥ 1000 V
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101F
MSL Rating
MSL Rating: Level 1
Test: 260°C convection reflow
Standard: JEDEC Standard IPC/JEDEC J-STD-020
Solderability
Compatible with both lead-free (260°C maximum reflow
temperature) and tin/lead (245°C maximum reflow
temperature) soldering processes.
Contact plating: NiPdAu
RoHS Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
Lead Free
Halogen Free (Chlorine, Bromine)
Antimony Free
TBBP-A (C15H12Br402) Free
PFOS Free
SVHC Free
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and information
about TriQuint:
Web: www.triquint.com
Email: [email protected]
Tel: +1.503.615.9000
Fax: +1.503.615.8902
For technical questions and application information:
Email: [email protected]
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein.
TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information
contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information
is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain
and verify the latest relevant information before placing orders for TriQuint products. The information contained herein
or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other
intellectual property rights, whether with regard to such information itself or anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining
applications, or other applications where a failure would reasonably be expected to cause severe personal injury or
death.
Datasheet: Rev. F 09-09-15
© 2015 TriQuint Semiconductor, Inc
- 11 of 11 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TQP5525.PDF ] | |
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