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PDF TQQ7303 Data sheet ( Hoja de datos )
| Número de pieza | TQQ7303 | |
| Descripción | 1747.5 MHz LTE Band 3 Uplink BAW Filter | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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RFMD + TriQuint = Qorvo
Applications
LTE Band 3 Uplink Infrastructure
Base Station
General Purpose Wireless
TQQ7303
1747.5 MHz LTE Band 3 Uplink BAW Filter
Product Features
75 MHz Bandwidth
High Attenuation
Low Loss
Single-ended Operation
Small Size: 3 x 3 x 1.02 mm
Surface Mount Device
RoHS Compliant, Pb-Free
6 Pin 3 x 3 mm leadless SMT Package
Functional Block Diagram
Ground
1
6 Ground
Input 2
5 Output
Ground 3
4 Ground
Top View
General Description
The TQQ7303 is an exceptionally high performance
uplink BAW filter for LTE Band 3. This filter is housed in
a compact 3 x 3 x 1.02 mm package for base station
applications.
Low insertion loss, coupled with high attenuation makes
this filter an ideal choice for uplink RF filtering needs.
The TQQ7303 is part of TriQuint’s extensive portfolio of
RF Baw and SAW filters.
Pin Configuration
Pin No.
2
5
1,3,4,6
Label
Input
Output
Case Ground
Datasheet: Rev D 10-15-15
© 2015 TriQuint Semiconductor, Inc
Ordering Information
Part No.
TQQ7303
Description
1747.5 MHz BAW Filter
TQQ7303-EVB
Evaluation board
Standard T/R size = 2500 pieces on a 7" reel
- 1 of 8 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
1 page  
RFMD + TriQuint = Qorvo
TQQ7303
1747.5 MHz LTE Band 3 Uplink BAW Filter
0.10 C
Package Marking and Dimensions
C
1.02±0.07
2x
0.10 C
2x
0.10 C
3.00±0.10
A
B
(5X) 0.650x X 0.600y
0.10 C A B
1.071
3.00±0.10
0.700
(1X) 1.400x X 0.600y
0.10 C A B
PIN 1
10
Pin #1 Identifier
SIDE VIEW
Package Marking
Product Identifier: Q7303
Date Code: YYWW
Assembly Code: AaXXXX
Q7303
YYWW
aXXXX
TOP VIEW
3.00±0.10
0.10 C
3.00±0.10
1.100
1.100
1.075
0.100±0.100
BOTTOM VIEW
0.100±0.100
C
1.02±0.07
2x
0.10 C
2x
0.10 C
3.00±0.10
A
B
(5X) 0.650x X
0.10 C
3.00±0.10
Pin #1 Identifier
3.00±0.10
3.00±0
SIDE VIEW
Notes:
1. All dimensions are in millimeters
2. All tolerances are ±0.15 mm except overall length and width ±0.10 mm
3. Contact plating : ENIG (Electroless Nickel Immersion Gold)
4. Terminations: 0.5 – 1.0 μm Au plating, over a 2 – 6 μm Ni plating
PCB Mounting Pattern
TOP VIEW
0.1
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
Datasheet: Rev D 10-15-15
© 2015 TriQuint Semiconductor, Inc
- 5 of 8 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet TQQ7303.PDF ] | |
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