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PDF PI6C5946004 Data sheet ( Hoja de datos )
| Número de pieza | PI6C5946004 | |
| Descripción | 6 GHz / 12 Gbps Clock / Data Fanout Buffer | |
| Fabricantes | Pericom Semiconductor | |
| Logotipo |  |
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PI6C5946004
6 GHz / 12 Gbps Clock / Data Fanout Buffer with Internal Termination
Features
ÎÎInput Clock Frequency up to 6 GHz Typical
ÎÎMaximum Input Data Rate up to 12 Gbps Typical
ÎÎ4 pairs of differential CML outputs
ÎÎLow additive jitter, < 0.05ps (max)
ÎÎInput accepts: CML, LVDS, CML, SSTL input level
ÎÎOutput to Output skew: <20ps
ÎÎOperating Temperature: -40oC to 85oC
ÎÎPower supply: 3.3V ±10% or 2.5V ±5%
ÎÎPackaging (Pb-free & Green)
ÎÎ16-pin TQFN available
Description
The PI6C5946004 is a high-performance low-skew 1-to-4 CML clock
or data fanout buffer. The inputs accept CML, LVDS, CML and
SSTL signals with internal termination resistors. PI6C5946004
is ideal for clock / data distribution applications.
Block Diagram
Pin Configuration
REF_IN+
VTH
REF_IN-
EN
D
Q
LE
Q0+
Q0- 16 15 14 13
Q1+
Q1-
Q1+ 1
12 REF_IN+
Q2+
Q2-
Q1- 2
Q3+ Q2+ 3
Q3- Q2- 4
11 VTH
10 VREF-AC
9 REF_IN-
5678
14-0179
1
PI6C5946004 Rev A
10/29/14
1 page  
PI6C5946004
6 GHz / 12 Gbps Clock / Data Fanout Buffer with Internal Termination
Output Swing vs Frequency
Typical Output Eye Diagrams
3.15Gb/s XAUI CML output waveform
6Gb/s SATA CML output waveform
10.5Gb/s Fiber Channel CML output waveform
12Gb/s SATA CML output waveform
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PI6C5946004 Rev A
10/29/14
5 Page 
PI6C5946004
6 GHz / 12 Gbps Clock / Data Fanout Buffer with Internal Termination
3) Chassis air flow and cooling mechanism. More air flow M/s
and adding heat sink on device can reduce device final die junc-
tion temperature Tj
The individual device thermal calculation formula:
Tj =Ta + Pchip x Ja
Tc = Tj - Pchip x Jc
Ja ___ Package thermal resistance from die to the ambient air
in C/W unit; This data is provided in JEDEC model simulation.
An air flow of 1m/s will reduce Ja (still air) by 20~30%
Jc ___ Package thermal resistance from die to the package case
in C/W unit
Tj ___ Die junction temperature in C (industry limit <125C
max.)
Ta ___ Ambiant air température in C
Tc ___ Package case temperature in C
Pchip___ IC actually consumes power through Iee/GND cur-
rent
Thermal calculation example
To calculate Tj and Tc of PI6CV304 in an SOIC-8 package:
Step 1: Go to Pericom web to find Ja=157 C/W, Jc=42 C/W
http://www.pericom.com/support/packaging/packaging-me-
chanicals-and-thermal-characteristics/
Step 2: Go to device datasheet to find Idd=40mA max.
Step 3: P_total= 3.3Vx40mA=0.132W
Step 4: If Ta=85C
Tj= 85 + Ja xP_total= 85+25.9 = 105.7C
Tc= Tj + Jc xP_total= 105.7- 5.54 = 100.1C
Note:
The above calculation is directly using Idd current without sub-
tracting the load power, so it is a conservative estimation. For
more precise thermal calculation, use P_unload or P_chip from
device Iee or GND current to calculate Tj, especially for CML
buffer ICs that have a 150ohm pull-down and equivalent 100ohm
differential RX load.
14-0179
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PI6C5946004 Rev A
10/29/14
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet PI6C5946004.PDF ] | |
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