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PDF CPC1983YE Data sheet ( Hoja de datos )
| Número de pieza | CPC1983YE | |
| Descripción | Normally Open Power SIP Relay | |
| Fabricantes | IXYS | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CPC1983YE (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Input / Output Isolation
Rating
600
0.5
6
4
Units
VP
Arms / ADC
kV
Features
• 4000Vrms Input/Output Isolation
• Handle Load Currents Up to 0.5A
• 600VP Blocking Voltage
• Power SIP Package
• High Reliability
• No Moving Parts
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• IC Equipment
• Home Appliances
Pin Configuration
CPC1983YE
Normally Open Power SIP Relay
Description
IXYS Integrated Circuits Division and its parent,
IXYS, have combined to bring OptoMOS® technology,
reliability, and compact size to a new family of
high-power Solid State Relays.
As part of this family, the CPC1983YE single-pole
normally open (1-Form-A) Solid State Power Relay
is rated for up to 0.5ADC / 0.5Arms continuous load
current.
The CPC1983YE employs optically coupled MOSFET
technology to provide 4000Vrms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED.
This combination of low on-resistance and high
load current handling capability makes this relay
suitable for a variety of high performance switching
applications.
The "E" suffix signifies an enhanced isolation voltage.
Approvals
• UL Recognized Component: File E69938
Ordering Information
Part #
CPC1983YE
Description
Power SIP Package (25 per tube)
Switching Characteristics of
Normally Open Devices
Form-A
IF
ILOAD
90%
ton
10%
toff
Pb
DS-CPC1983YE-R02
e3
www.ixysic.com
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INTEGRATED CIRCUITS DIVISION
CPC1983YE
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC1983YE
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC1983YE
Maximum Temperature x Time
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R02 www.ixysic.com
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5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CPC1983YE.PDF ] | |
Hoja de datos destacado
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