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PDF CPC1718 Data sheet ( Hoja de datos )

Número de pieza CPC1718
Descripción DC-Only Power Relay
Fabricantes IXYS 
Logotipo IXYS Logotipo



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No Preview Available ! CPC1718 Hoja de datos, Descripción, Manual

INTEGRATED CIRCUITS DIVISION
Characteristics
Parameter
Blocking Voltage
Load Current, TA=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case, JC
Rating
100
17.5
6.75
0.075
0.3
Units
VP
ADC
°C/W
Features
17.5ADC Load Current with 5°C/W Heat Sink
Low 0.075On-Resistance
100VP Blocking Voltage
2500Vrms Input/Output Isolation
Low Thermal Resistance: JC = 0.3 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL 508 Certified Component: File E69938
CSA Certified Component: Certificate 1172007
Pin Configuration
12
+-
34
-+
CPC1718
100V Single-Pole, Normally Open
DC-Only Power Relay
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1718 single-pole
normally open (1-Form-A) DC Solid State Power
Relay employs optically coupled MOSFET technology
to provide 2500Vrms of input to output isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance DC switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500Vrms isolation but also very low junction-to-case
thermal resistance (0.3 °C/W).
Ordering Information
Part
CPC1718J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
IF
ILOAD
90%
ton
10%
toff
DS-CPC1718-R08
www.ixysic.com
1

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CPC1718 pdf
INTEGRATED CIRCUITS DIVISION
CPC1718
Typical Load Current
vs. Load Voltage
(IF=10mA)
10
9
8
7
6
5
4
3
2
1
0
0 0.03 0.06 0.09 0.12 0.15 0.18 0.21
Load Voltage (V)
0.11
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
-40
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=Max Rated)
-20 0 20 40 60 80
Temperature (ºC)
100
Maximum Load Current
vs. Temperature with Heatsink
35
30 1ºC/W
25
20 5ºC/W
15 10ºC/W
10 Free Air
5
0
0 20 40 60 80 100
Temperature (ºC)
128
126
124
122
120
118
116
114
112
-40
Typical Blocking Voltage
vs. Temperature
-20 0 20 40 60 80
Temperature (ºC)
100
0.066
0.060
0.054
0.048
0.042
0.036
0.030
0.024
0.018
0.012
-40
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=1ADC)
-20 0 20 40 60 80
Temperature (ºC)
100
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(VL=100VP)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40 -20
0 20 40 60
Temperature (ºC)
80 100
Energy Rating Curve
Free Air, No Heat Sink
50
45
40
35
30
25
20
15
10
5
0
10µs 100µs 1ms 10ms 100ms 1s 10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
5
www.ixysic.com
R08

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