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Número de pieza | ISZ-2510 | |
Descripción | single axis MEMS gyroscope IC | |
Fabricantes | InvenSense | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de ISZ-2510 (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
No Preview Available ! InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com
Document Number: PS-ISZ-2510A-00
Revision: 1.0
Release Date: 12/24/2013
ISZ-2510
Product Specification
Revision 1.0
Confidential & Proprietary
1 of 47
1 page ISZ-2510 Product Specification
Document Number: PS-ISZ-2510A-00
Revision: 1.0
Release Date: 12/24/2013
1.2 Purpose and Scope
This document is a preliminary product specification, providing a description, specifications, and design
related information for the single axis ISZ-2510™ gyroscope. The device is housed in a small 3x3x0.9mm
QFN package.
1.3 Product Overview
The ISZ-2510 is a single-chip, digital output, single axis MEMS gyroscope IC which features a 512-byte
FIFO. The FIFO can lower the traffic on the serial bus interface, and reduce power consumption by allowing
the system processor to burst read sensor data and then go into a low-power mode.
The gyroscope includes a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec,
very low Rate noise at 0.01 dps/√Hz and extremely low power consumption at 2.8mA. Factory-calibrated
initial sensitivity reduces production-line calibration requirements.
Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock
with 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The
device features I2C and SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital
IO supply, VDDIO from 1.71V to 3.6V.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the gyro
package size down to a footprint and thickness of 3x3x0.9mm (16-pin QFN), to provide a very small yet high
performance low cost package. The device provides high robustness by supporting 10,000 g shock
reliability.
1.4 Applications
Toys
Tools
Industrial
Confidential & Proprietary
5 of 47
5 Page ISZ-2510 Product Specification
Document Number: PS-ISZ-2510A-00
Revision: 1.0
Release Date: 12/24/2013
3.5 SPI Timing Characterization
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VDDIO = 1.8V, TA = 25°C,
Parameters
SPI TIMING
fSCLK, SCLK Clock Frequency
Conditions
Min Typical
tLOW, SCLK Low Period
tHIGH, SCLK High Period
tSU.CS, CS Setup Time
tHD.CS, CS Hold Time
tSU.SDI, SDI Setup Time
tHD.SDI, SDI Hold Time
tVD.SDO, SDO Valid Time
tHD.SDO, SDO Hold Time
tDIS.SDO, SDO Output Disable Time
Cload = 20pF
Cload = 20pF
400
400
8
500
11
7
4
Max
11
202
100
10
Units
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes:
1. R/W of all Registers
2. Read of Sensor Registers only
SPI Bus Timing Diagram
Confidential & Proprietary
11 of 47
11 Page |
Páginas | Total 30 Páginas | |
PDF Descargar | [ Datasheet ISZ-2510.PDF ] |
Número de pieza | Descripción | Fabricantes |
ISZ-2510 | single axis MEMS gyroscope IC | InvenSense |
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