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Número de pieza | TMC1340-SO | |
Descripción | Quad Complementary N & P-Channel 30V Enhancement Mode Power MOSFET | |
Fabricantes | TRINAMIC | |
Logotipo | ||
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No Preview Available ! POWER MOSFETs FOR STEPPER MOTORS
INTEGRATED CIRCUITS
TMC1340-SO DATASHEET
Quad Complementary N & P-Channel 30V Enhancement Mode Power MOSFET with extremely low on-
resistance. High energy efficiency and good thermal performance.
PRODUCT SUMMARY
BVDSS
RDS(ON)
ID
N-CH
30V
33mΩ
5.5A
P-CH
-30V
55mΩ
-4.1A
FEATURES AND BENEFITS
N & P-Channel MOSFET Full Bridge Device
Simple Drive Requirement
Low On-Resistance
Good Thermal Performance
Fast Switching Performance for quick motor reaction
SO-8 package, 5x6 mm
RoHS Compliant and Halogen-Free
TMC262 WITH 4X TMC1340-SO MOSFETS
TMC262
APPLICATIONS
TMC1340-SO MOSFETs fit best with
TRINAMIC 2-phase bipolar stepper
motor drivers:
TMC262: up to 3A RMS motor current
with 2xTMC1340-SO
TMC248: up to 2.5A RMS motor current
with 2xTMC1340-SO
TMC249: up to 2.5A RMS motor current
with 2xTMC1340-SO
DESCRIPTION
The TMC1340-SO N & P channel MOSFET
full bridge (H-bridge) device achieves a
very low on-state resistance combined
with fastest switching performance. This
device is intended for power conversion
and power management applications
that require high energy efficiency and
power density while keeping costs
down.
The SO-8 5x6 package is widely used for
commercial and industrial surface-
mounted applications, and it is well
suited for, e.g., motor driver circuits.
+VM
TMC1340
PP
NN
Motor
coil A
+VM
TMC1340
Motor
coil B
PP
NN
10R
Order code
TMC1340-SO
RSENSE
RSENSE
10R
Description
N and P-channel enhancement mode power MOSFET
TRINAMIC Motion Control GmbH & Co. KG
Hamburg, Germany
Size
5 x 6 mm2
1 page TMC1340-SO DATASHEET (Rev. 1.02 / 2014-JUN-04)
5
4.2 P-CH @tj=25°C (unless otherwise specified)
Parameter
Symbol Test Conditions Min Typ Max Unit
Drain-Source Breakdown Voltage BVDSS
Static Drain-Source On-Resistance* RDS(ON)
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
VGS(th)
gfs
Drain-Source Leakage Current
IDSS
(tj=70˚C)
Gate-Source Leakage
IGSS
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain ("Miller") Charge
Qgd
Turn-on Delay Time*
td(on)
Rise Time
tr
Turn-off Delay Time
td(off)
Fall Time
tf
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Gate Resistance
Rg
* Pulse width ≤ 300µs, duty cycle ≤ 2%
VGS=0V, ID=-250µA
VGS=-10V, ID=-4A
VGS=-4.5V, ID=-2A
VDS= VGS, ID=-250µA
VDS= -10V, ID=-4A
VDS= -30V, VGS=0V
VDS= -24V, VGS=0V
VDS= 0V, VGS=±20V
ID=-4A
VDS=-24V
VGS=-4.5V
VDS=-15V
ID=-1A
RG=3.3Ω VGS=-10V
RD=15Ω
VGS=0V
VDS=-25V
f=1.0MHz
f=1.0MHz
-30
-1
V
55 mΩ
100 mΩ
-3 V
4S
-1 µA
-25 µA
±100 nA
8 11 nC
1.5 nC
4 nC
6.6 ns
7.7 ns
22 ns
9.3 ns
570 790
pF
80 pF
75 pF
6 12 Ω
4.2.1 Source-Drain Diode
Parameter
Symbol Test Conditions Min Typ Max Unit
Forward On Voltage*
VSD
Reverse Recovery Time
trr
Reverse Recovery Charge
Qrr
* Pulse width ≤ 300µs, duty cycle ≤ 2%
VGS=0V, IS=-1.2A
VGS=0V, IS=-4A
dl/dt=100A/µs
-1.2 V
18 ns
10 nC
www.trinamic.com
5 Page TMC1340-SO DATASHEET (Rev. 1.02 / 2014-JUN-04)
11
8 Disclaimer
TRINAMIC Motion Control GmbH & Co. KG does not authorize or warrant any of its products for use in
life support systems, without the specific written consent of TRINAMIC Motion Control GmbH & Co.
KG. Life support systems are equipment intended to support or sustain life, and whose failure to
perform, when properly used in accordance with instructions provided, can be reasonably expected to
result in personal injury or death.
Information given in this data sheet is believed to be accurate and reliable. However no responsibility
is assumed for the consequences of its use nor for any infringement of patents or other rights of
third parties which may result from its use.
Specifications are subject to change without notice.
All trademarks used are property of their respective owners.
9 ESD Sensitive Device
The TMC1340-SO is an ESD sensitive CMOS device sensitive to electrostatic discharge. Take special care
to use adequate grounding of personnel and machines in manual handling. After soldering the
devices to the board, ESD requirements are more relaxed. Failure to do so can result in defect or
decreased reliability.
www.trinamic.com
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet TMC1340-SO.PDF ] |
Número de pieza | Descripción | Fabricantes |
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