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PDF CYBLE-212019-00 Data sheet ( Hoja de datos )
| Número de pieza | CYBLE-212019-00 | |
| Descripción | EZ-BLE PRoC Module | |
| Fabricantes | Cypress Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CYBLE-212019-00 (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
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PRELIMINARY
CYBLE-212019-00
EZ-BLETM PRoCTM Module
General Description
The CYBLE-212019-00 is a Bluetooth Low Energy (BLE)
wireless module solution. The CYBLE-212019-00 is a turnkey
solution and includes onboard crystal oscillators, trace antenna,
passive components, and the Cypress PRoC™ BLE. Refer to
the CYBL10XX7X datasheet for additional details on the capabil-
ities of the PRoC BLE device used on this module.
The CYBLE-212019-00 supports a number of peripheral
functions (ADC, timers, counters, PWM) and serial
communication protocols (I2C, UART, SPI) through its
programmable architecture. The CYBLE-212019-00 includes a
royalty-free BLE stack compatible with Bluetooth 4.1 and
provides up to 23 GPIOs in a 14.52 × 19.20 × 2.00 mm package.
The CYBLE-212019-00 is fully certified and qualified. The
CYBLE-212019-00 is drop-in compatible with the
CYBLE-012011-00 EZ-BLE PRoC Module.
The CYBLE-212019-00 is a complete solution targeted at appli-
cations requiring cost optimized BLE wireless connectivity.
Module Description
■ Module size: 14.52 mm ×19.20 mm × 2.00 mm (with shield)
■ Castelated solder pad connections for ease-of-use
■ 256-KB flash memory, 32-KB SRAM memory
■ Up to 23 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z analog, HI-Z digital, or strong output
■ Bluetooth 4.1 single-mode module
■ Certified to FCC, IC, MIC, KC, and CE regulations
■ Industrial temperature range: –40 °C to +85 °C
■ 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
■ Watchdog timer with dedicated internal low-speed oscillator
(ILO)
■ Two-pin SWD for programming
Power Consumption
■ TX output power: –18 dbm to +3 dbm
■ Received signal strength indicator (RSSI) with 1-dB resolution
■ TX current consumption of 15.6 mA (radio only, 0 dbm)
■ RX current consumption of 16.4 mA (radio only)
■ Low power mode support
❐ Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on
❐ Hibernate: 150 nA with SRAM retention
❐ Stop: 60 nA with XRES wakeup
Functional Capabilities
■ Up to 22 capacitive sensors for buttons or sliders with
best-in-class signal-to-noise ratio (SNR) and liquid tolerance
■ 12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
■ Two serial communication blocks (SCBs) supporting I2C
(master/slave), SPI (master/slave), or UART
■ Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
■ LCD drive supported on all GPIOs (common or segment)
■ Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
■ I2S master interface
■ Bluetooth Low Energy protocol stack supporting generic
access profile (GAP) Central, Peripheral, Observer, or
Broadcaster roles
■ Switches between Central and Peripheral roles on-the-go
■ Standard Bluetooth Low Energy profiles and services for
interoperability
■ Custom profile and service for specific use cases
Benefits
The CYBLE-212019-00 module is provided as a turnkey
solution, including all necessary hardware required to use BLE
communication standards.
■ Proven hardware design ready to use
■ Cost optimized for applications without space constraint
■ Reprogrammable architecture
■ Fully certified module eliminates the time needed for design,
development and certification processes
■ Bluetooth SIG qualified with QDID and Declaration ID
■ Flexible communication protocol support
■ PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
BLE application
Cypress Semiconductor Corporation
Document Number: 002-09764 Rev. *A
198 Champion Court
San Jose, CA 95134-1709
408-943-2600
Revised February 23, 2016
1 page  
PRELIMINARY
Figure 1. Module Mechanical Drawing
CYBLE-212019-00
Top View (View from Top)
Side View
Bottom View (Seen from Bottom)
Note
1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on
recommended host PCB layout, see Figure 3, Figure 4, Figure 5, and Figure 6 and Table 3.
Document Number: 002-09764 Rev. *A
Page 5 of 38
5 Page 
PRELIMINARY
CYBLE-212019-00
Figure 8. Recommended Host Schematic for an Independent Supply Option
Document Number: 002-09764 Rev. *A
Page 11 of 38
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet CYBLE-212019-00.PDF ] | |
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