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PDF MTN2302N3 Data sheet ( Hoja de datos )
| Número de pieza | MTN2302N3 | |
| Descripción | N-Channel Enhancement Mode MOSFET | |
| Fabricantes | CYStech | |
| Logotipo |  |
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CYStech Electronics Corp.
20V N-CHANNEL Enhancement Mode MOSFET
MTN2302N3
Spec. No. : C323N3
Issued Date : 2004.04.05
Revised Date : 2004.10.22
Page No. : 1/5
..
Features
• VDS=20V
RDS(ON)=65mΩ@VGS=4.5V, IDS=3.6A
RDS(ON)=95mΩ@VGS=2.5V, IDS=3.1A
• Advanced trench process technology
• High density cell design for ultra low on resistance
• Excellent thermal and electrical capabilities
• Compact and low profile SOT-23 package
Equivalent Circuit
MTN2302N3
Outline
SOT-23
D
G：Gate
S：Source
D：Drain
Absolute Maximum Ratings (Ta=25°C)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Maximum Power Dissipation
Operating Junction Temperature
Storage Temperature
Ta=25℃
Ta=75℃
Symbol
VDS
VGS
ID
IDM
PD
Tj
Tstg
MTN2302N3
GS
Limits
20
±8
2.4
10
1.25
0.8
-55~+150
-55~+150
Unit
V
V
A
A
W
°C
°C
CYStek Product Specification
1 page  
CYStech Electronics Corp.
SOT-23 Dimension
Spec. No. : C323N3
Issued Date : 2004.04.05
Revised Date : 2004.10.22
Page No. : 5/5
..
A
L
3
S
B
12
VG
C
D H KJ
Marking:
0T2E
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
Style: Pin 1.Gate 2.Source 3.Drain
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.1102 0.1204 2.80 3.04
B 0.0472 0.0630 1.20 1.60
C 0.0335 0.0512 0.89 1.30
D 0.0118 0.0197 0.30 0.50
G 0.0669 0.0910 1.70 2.30
H 0.0005 0.0040 0.013 0.10
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
J 0.0034 0.0070 0.085 0.177
K 0.0128 0.0266 0.32 0.67
L 0.0335 0.0453 0.85 1.15
S 0.0830 0.1083 2.10 2.75
V 0.0098 0.0256 0.25 0.65
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTN2302N3
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet MTN2302N3.PDF ] | |
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