Datasheet TAZAXXXXXXXX Equivalent ( PDF )

N.º	Número de pieza	Descripción	Fabricantes	Category
1	TAZAxxxxxxxx	TAZ Series / COTS-Plus TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave or Vapor Phase), conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance cod	AVX Corporation	data

TAZ Datasheet ( Hoja de datos ) - resultados coincidentes

N.º	Número de pieza	Descripción	Fabricantes	Catagory
1	TAZ1	Rectifying Valve	Tungsram	data
2	TAZA104*050Cxxxx	TAZ Series / COTS-Plus TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave or Vapor Phase), conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance cod	AVX Corporation	data
3	TAZA104*050Lxxxx	TAZ Series / COTS-Plus TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave or Vapor Phase), conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance cod	AVX Corporation	data
4	TAZA105*010Cxxxx	TAZ Series / COTS-Plus TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave or Vapor Phase), conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance cod	AVX Corporation	data
5	TAZA105*010Lxxxx	TAZ Series / COTS-Plus TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave or Vapor Phase), conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance cod	AVX Corporation	data
6	TAZA105*015Lxxxx	TAZ Series / COTS-Plus TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave or Vapor Phase), conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance cod	AVX Corporation	data
7	TAZA105*020Cxxxx	TAZ Series / COTS-Plus TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave or Vapor Phase), conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance cod	AVX Corporation	data
8	TAZA105*020Lxxxx	TAZ Series / COTS-Plus TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave or Vapor Phase), conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance cod	AVX Corporation	data
9	TAZA154*050Cxxxx	TAZ Series / COTS-Plus TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave or Vapor Phase), conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance cod	AVX Corporation	data

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Número de pieza	Descripción	Fabricantes	PDF
SPS122	Modern EU gaming Machines require increased +12V current to accommodate the latest gaming peripherals. DC Converters have been engineered with Sanken’s latest technology to efficiently convert redundant power from our lamp gaming PSU and provide additional +12V capacity at the point of use.	Sanken	PDF

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