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Datasheet CPD87R Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | Category |
| 1 | CPD87R | Low Leakage Schottky Diode Chip PROCESS
CPD87R
Schottky Diode
Low Leakage Schottky Diode Chip
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 14.6 x 14.6 MILS 3.9 MILS 11.8 x 11.8 MILS Al - 30,000Å Au - 12,000Å
GEOMETRY GROSS DIE PER 5 INCH W |  centralsemi | diode |
CPD Datasheet ( Hoja de datos ) - resultados coincidentes |
| N.º | Número de pieza | Descripción | Fabricantes | Catagory |
| 1 | CPD-110EST | Service Manual w
eMANUAL SERVICE e h S REVISED a t a D . w w
U 4 t
.
m o c
CPD-110GS/110EST
CPD-110GS
US Model Canadian Model
Chassis No. SCC-L27A-A CPD-110EST
Chassis No. SCC-L27B-A
SPECIFICATIONS
CRT
Viewable image size
Resolution
Standard image area
w
w
w
.D
Deflection frequency* AC input voltag  Sony data | | |
| 2 | CPD-110GS | Service Manual w
eMANUAL SERVICE e h S REVISED a t a D . w w
U 4 t
.
m o c
CPD-110GS/110EST
CPD-110GS
US Model Canadian Model
Chassis No. SCC-L27A-A CPD-110EST
Chassis No. SCC-L27B-A
SPECIFICATIONS
CRT
Viewable image size
Resolution
Standard image area
w
w
w
.D
Deflection frequency* AC input voltag Sony data | | |
| 3 | CPD-200SX | Color Computer Display
www.Da Sony data | | |
| 4 | CPD-200SX | Color Computer Display Service Manual
www.Da Sony data | | |
| 5 | CPD-E500 | TORINITORON COLOR COMPUTER DISPLAY SERVICE MANUAL CPD-E500/E500E
SERVICE MANUAL
CPD-E500
US Model Canadian Model
Chassis No. SCC-L22P-A
CPD-E500E
AEP Model
Chassis No. SCC-L22N-A
G1 CHASSIS
CRT
Viewable image size Resolution
Maximum Recommended Standard image area
Deflection frequency*
SPECIFICATIONS
0.24 mm aperture grille pitch 21 inches me Sony data | | |
| 6 | CPD-G520 | TRINITRON COLOR COMPUTER DISPLAY SERVICE MANUAL SERVICE MANUAL
CPD-G520
US Model Canadian Model N. Hemisphere Model S. Hemisphere Model
Equator Model
Chassis No. SCC-L33E-A
CR1 CHASSIS
CRT
Viewable image size Resolution
Maximum Recommended Input signal levels
Standard image area
SPECIFICATIONS
0.24 mm aperture grille pitch 21 inches measured Sony data | | |
| 7 | CPD04 | General Purpose Rectifier 500mA Glass Passivated Rectifier Chip PROCESS
General Purpose Rectifier
500mA Glass Passivated Rectifier Chip
CPD04
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 26 x 26 MILS 8.5 MILS 14 x 14 MILS Ni/Au - 5,000Å/2,000Å Ni  Central Semiconductor rectifier | | |
| 8 | CPD05 | General Purpose Rectifier 1 Amp Glass Passivated Rectifier Chip PROCESS
General Purpose Rectifier
1 Amp Glass Passivated Rectifier Chip
CPD05
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 51 x 51 MILS 10.2 MILS 36 x 36 MILS Ni/Au - 5,000Å/2,000Å N Central Semiconductor rectifier | | |
| 9 | CPD06 | General Purpose Rectifier 3 Amp Glass Passivated Rectifier Chip PROCESS
General Purpose Rectifier
3 Amp Glass Passivated Rectifier Chip
CPD06
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 89 x 89 MILS 10.2 MILS 66 x 66 MILS Ni/Au - 5,000Å/2,000Å N Central Semiconductor rectifier | |
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