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Datasheet BU7961GUW Equivalent ( PDF )

N.º Número de pieza Descripción Fabricantes PDF
3 BU7961GUW   Silicon Monolithic Integrated Circuit

1/4 STRUCTURE PRODUCTNAME Silicon Monolithic Integrated Circuit BU7961GUW Serial Interface for Mobile Devices Application MSDL3(Mobile Shrink Data Link 3) Serializer LSI FUNCTION FEATURES ·Maximum transmission rate of highspeed differential interface MSDL3 is 900Mbps. ·S
ROHM Semiconductor
ROHM Semiconductor
datasheet BU7961GUW pdf
2 BU7961GUW   Silicon Monolithic Integrated Circuit

1/4 STRUCTURE PRODUCTNAME Silicon Monolithic Integrated Circuit BU7961GUW Serial Interface for Mobile Devices Application MSDL3(Mobile Shrink Data Link 3) Serializer LSI FUNCTION FEATURES ·Maximum transmission rate of highspeed differential interface MSDL3 is 900Mbps. ·S
ROHM Semiconductor
ROHM Semiconductor
datasheet BU7961GUW pdf
1 BU7961GUW   Silicon Monolithic Integrated Circuit

1/4 STRUCTURE PRODUCTNAME Silicon Monolithic Integrated Circuit BU7961GUW Serial Interface for Mobile Devices Application MSDL3(Mobile Shrink Data Link 3) Serializer LSI FUNCTION FEATURES ·Maximum transmission rate of highspeed differential interface MSDL3 is 900Mbps. ·S
ROHM Semiconductor
ROHM Semiconductor
datasheet BU7961GUW pdf


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Número de pieza Descripción Fabricantes PDF
SPS122

Modern EU gaming Machines require increased +12V current to accommodate the latest gaming peripherals. DC Converters have been engineered with Sanken’s latest technology to efficiently convert redundant power from our lamp gaming PSU and provide additional +12V capacity at the point of use.

Sanken
Sanken
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