MMBZ5259BW Datasheet PDF

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-323 Plastic-Encapsulate Diode MMBZ5221BW-MMBZ5259BW ZENER DIODE FEATURES： Planar Die Construction 200mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly Marking: see table on page2 The first code SOT- 323 Maximum Ratings(Ta= 25℃ unless otherwise specified) Characteristic Forward Voltag

MMBZ5221BW thru MMBZ5259BW SURFACE MOUNT SILICON ZENER DIODES VOLTAGE FEATURES Planar Die construction 200mW Power Dissipation Zener Voltages from 2.4V - 39V Ideally Suited for Automated Assembly Processes 2.4 - 39 Volts POWER 200 mWatts PACKAGE SOT-323 MECHANICAL DATA Case: SOT-323, Plastic Terminals: Solderable per MIL-STD-202, Method 208 Approx. Weight: 0.008 gram SINGLE MAXIMUM RAT

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-23 Plastic-Encapsulate Diodes MMBZ5221C-MMBZ5259C ZENER DIODE FEATURES Planar Die Construction General Purpose, Medium Current Ideally Suited

Features Planar Die Construction Dual Isolated Zeners in Ultra-Small Surface Mount Package Ideally Suited for Automated Assembly Processes Lead Free, RoHS Compliant (Note 2) "Green" Device (Note

• 225 mW Rating on FR−4 or FR−5 Board • Zener Voltage Range − 2.4V • Package Designed for Optimal Automated Board Assembly

MMBTA44 Rev.E Oct.-2016 DATA SHEET 描述 , Descriptions SOT-23 塑封封 NPN 半 三 管。Silicon NPN transistor in a SOT-23 Plastic Package.  特征 , Features 耐 高, 和 降低。 High