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PDF CPC1977 Data sheet ( Hoja de datos )
| Número de pieza | CPC1977 | |
| Descripción | Power Relay | |
| Fabricantes | Clare | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CPC1977 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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CPC1977
i4-PAC™ Power
Relay
Characteristics
Parameter
Blocking Voltage
Load Current, TA=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance
RθJC
Rating
600
3.1
1.25
1
0.35
Units
VP
Arms
Ω
°C/W
Features
• 3.1Arms Load Current with 5°C/W Heat Sink
• Low 1Ω On-Resistance
• 600VP Blocking Voltage
• 2500Vrms Input/Output Isolation
• Low Thermal Resistance (0.35 °C/W)
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Recognized Component: File E69938
Pin Configuration
RoHS
2002/95/EC
e3
Description
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new family
of high-power Solid State Relays.
As part of this family, the CPC1977 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.1Arms continuous load current with a
5°C/W heat sink.
The CPC1977 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The output, constructed with efficient
MOSFET switches and photovoltaic die, uses Clare’s
patented OptoMOS architecture while the input, a
highly efficient GaAlAs infrared LED, provides the
optically coupled control. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low thermal resistance (0.35 °C/W).
Ordering Information
Part
CPC1977J
Description
i4-PAC Package (25 per tube)
Switching Characteristics
Form-A
I
F
ILOAD
90%
ton
10%
toff
DS-CPC1977 - R06
www.clare.com
1
1 page  
PRELIMINARY
CPC1977
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
Typical On-Resistance
vs. Temperature
(IF=20mA, IL=0.75A)
-20 0 20 40 60 80
Temperature (ºC)
100
845
840
835
830
825
820
815
810
805
-40
Typical Blocking Voltage
vs. Temperature
-20 0 20 40 60 80
Temperature (ºC)
100
1.25
1.00
0.75
0.50
0.25
0
-0.25
-0.50
-0.75
-1.00
-1.25
-2.0
Typical Load Current
vs. Load Voltage
(IF=10mA, TA=25ºC)
-1.33 -0.66 0 0.66 1.33
Load Voltage (V)
2.0
0.014
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(VL=600VP)
0.012
0.010
0.008
0.006
0.004
0.002
0
-40 -20
0 20 40 60
Temperature (ºC)
80 100
Maximum Load Current
vs. Temperature with Heat Sink
8
1ºC/W
7
(IF=20mA)
6
5
4 5ºC/W
3 10ºC/W
2 Free Air
1
0
0 20 40 60 80 100
Temperature (ºC)
Energy Rating Curve
Free Air, No Heat Sink
18
15
12
9
6
3
0
10µs 100µs 1ms 10ms 100ms 1s
Time
10s 100s
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
5
www.clare.com
R06
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet CPC1977.PDF ] | |
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