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PDF MMSZ5263B Data sheet ( Hoja de datos )

Número de pieza MMSZ5263B
Descripción 500mW SURFACE MOUNT ZENER DIODE
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Features
Planar Die Construction
500mW Power Dissipation
General Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Note 4)
Qualified to AEC-Q101 Standards for High Reliability
MMSZ5263B
500mW SURFACE MOUNT ZENER DIODE
Mechanical Data
Case: SOD-123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Forward Voltage (Note 3)
@ IF = 10mA
Symbol
VF
Value
0.9
Unit
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 1) @TL = 75°C
Thermal Resistance, Junction to Ambient Air (Note 1)
Thermal Resistance, Junction to Lead (Note 2)
Operating and Storage Temperature Range
Symbol
PD
RθJA
RθJL
TJ, TSTG
Value
500
350
150
-65 to +150
Unit
mW
°C/W
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Type
Number
MMSZ5263B
Type
Code
M8
Zener Voltage Range (Note 3)
Nom (V)
56
VZ @ IZT
Min (V)
53.20
Max (V)
58.80
Test
Current
IZT
mA
2.2
Maximum Zener
Impedance (Note 5)
ZZT @ IZT
ZZK @ IZK
= 0.25mA
Ω
150 1300
Maximum Reverse
Leakage Current (Note 3)
IR @ VR
μA V
0.1 43
Notes:
1. Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout.
2. Thermal Resistance measurement obtained via infrared scan method.
3. Short duration pulse test used to minimize self-heating effect.
4. No purposefully added lead. Halogen and Antimony Free.
5. f = 1KHz.
MMSZ5263B
Document number: DS31652 Rev. 4 - 2
1 of 3
www.diodes.com
September 2009
© Diodes Incorporated

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