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PDF PWB Data sheet ( Hoja de datos )

Número de pieza PWB
Descripción Thin Film Power Resistors
Fabricantes Vishay 
Logotipo Vishay Logotipo



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PWB
Vishay Electro-Films
Thin Film Power Resistors
Product may not
be to scale
The PWB series resistor chips offer a 1 W power rating in a
relatively small size. They offer one of the best combinations
of size and power available.
The PWBs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The PWBs are 100 % electrically tested and
visually inspected to MIL-STD-883.
FEATURES
Wire bondable
Power: 1 W
Chip size: 0.070 inches square
Resistance range: 0.3 Ω to 20 kΩ
Oxidized silicon substrate for good power dissipation
Resistor material: Tantalum nitride, self-passivating
APPLICATIONS
The PWB resistor chips are used mainly in higher power circuits of amplifiers where increased power loads require a more
specialized resistor.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
5% 1%
0.5 %
*
0.3 Ω 2 Ω 10 Ω 50 Ω
* ± 600 ppm/C R < 2 Ω
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
10 kΩ
20 kΩ
PROCESS CODE
CLASS H*
CLASS K*
001 005
000 004
008 009
*MIL-PRF-38534 inspection criteria
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100 Ω - 250 kΩ
< 100 Ω or > 251 kΩ
MoistureResistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 500 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
Steady State
5 x Rated Power
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
(Conductive Epoxy Die Sttach to Alumina Substrate)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
- 35 dB typ.
- 20 dB typ.
± 0.5 % max. ΔR/R
± 0.5 % max. ΔR/R
- 55 °C to + 125 °C
± 0.1 % max. ΔR/R
± 0.2 % max. ΔR/R
200 V
1012 min.
100 V max.
200 V max.
1W
± 0.25 % max. ΔR/R %
www.vishay.com
62
For technical questions, contact: [email protected]
Document Number: 61021
Revision: 12-Mar-08

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