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PDF ESD7C Data sheet ( Hoja de datos )
| Número de pieza | ESD7C | |
| Descripción | TVS Diode ( Rectifier ) | |
| Fabricantes | ON Semiconductor | |
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ESD7C, SZESD7C SERIES
Transient Voltage
Suppressors
Micro−Packaged Diodes for ESD Protection
The ESD7CxxD Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage, and
fast response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its small size, it is suited
for use in cellular phones, portable devices, digital cameras, power
supplies and many other portable applications.
Specification Features:
• Low Capacitance 6.2 pF to 13 pF
• Low Clamping Voltage
• Small Body Outline Dimensions:
0.047″ x 0.047″ (1.20 mm x 1.20 mm)
• Low Body Height: 0.020″ (0.5 mm)
• Stand−off Voltage: 3.3 V, 5 V
• Low Leakage
• Response Time < 1 ns
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• IEC61000−4−2 Level 4 ESD Protection
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These are Pb−Free Devices
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
IEC 61000−4−2 (ESD)
Contact
Air
Symbol
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Derate above 25°C
Thermal Resistance Junction−to−Ambient
Junction and Storage Temperature Range
⎪
PD
RqJA
TJ, Tstg
Value
±8.0
±15
240
1.9
525
−55 to
+150
Unit
kV
mW
mW/°C
°C/W
°C
http://onsemi.com
PIN 1. CATHODE
2. CATHODE
3. ANODE
1
2
3
MARKING
DIAGRAM
SOT−723
CASE 631AA
L5 M
1
L5 = Specific Device Code
M = Date Code
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
ESD7CxxDT5G
Package
SOT−723
(Pb−Free)
Shipping†
8000 /
Tape & Reel
SZESD7CxxDT5G SOT−723
(Pb−Free)
8000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
Lead Solder Temperature − Maximum
(10 Second Duration)
TL 260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2012
March, 2012 − Rev. 3
1
Publication Order Number:
ESD7C3.3D/D
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet ESD7C.PDF ] | |
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