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PDF CM1425 Data sheet ( Hoja de datos )
| Número de pieza | CM1425 | |
| Descripción | 4-Channel EMI Filter Array | |
| Fabricantes | ON Semiconductor | |
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CM1425
4-Channel EMI Filter Array
with ESD Protection
Product Description
The CM1425 is an EMI filter array with ESD protection, which
integrates 4 pi filters (C−R−C). The CM1425 has component values of
20 pF − 100 W − 20 pF. The parts include ESD protection diodes on
every pin, which provide a very high level of protection for sensitive
electronic components that may be subjected to electrostatic discharge
(ESD). The ESD diodes connected to the filter ports safely dissipate
ESD strikes of ±15 kV, well beyond the maximum requirement of the
IEC 61000 −4−2 international standard. Using the MIL −STD−883
(Method 3015) specification for HumanBody Model (HBM) ESD, the
pins are protected for contact discharges at greater than ±30 kV.
This device is particularly well−suited for portable electronics (e.g.
mobile handsets, PDAs, notebook computers) because of its small
package and easy−to−use pin assignments. In particular, the CM1425
is ideal for EMI filtering and protecting data lines from ESD in
wireless handsets.
All CM1425 devices are optionally available with OptiGuardt
coating which results in improved reliability at assembly . These
devices are also available with standard lead−free finishing. The
CM1425 is housed in a space−saving, low−profile, chip−scale package
and is fabricated with the Centuriont processes.
Features
• Four Channels of EMI Filtering with ESD Protection
• Pin Compatible with the CSPRC032A
• Greater than 30 dB Attenuation Over the 800 MHz to 3 GHz
Frequency Range
• ±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge)
• ±30 kV ESD Protection (HBM)
• 9−Bump, 2.470 mm x 0.970 mm Footprint Chip Scale Package
(CSP)
• Available with OptiGuardt Coating for Improved Reliability
• These Devices are Pb−Free and are RoHS Compliant
Applications
• Filtering for Antenna and Keypad Data Lines
• I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs, etc.
• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers
• EMI Filtering for LCD and Chip−to−Chip Data Lines in Mobile
Electronic Devices that Use Flexible PCB Interconnections
http://onsemi.com
WLCSP9
CP SUFFIX
CASE 567BF
MARKING DIAGRAM
N251
N253
CM1425−01
9−Bump CSP Package
CM1425−03
9−Bump CSP Package
N251 = CM1425−01CP
N253 = CM1425−03CP
ORDERING INFORMATION
Device
Package
Shipping†
CM1425−01CP CSP−9 3500/Tape & Reel
(Pb−Free)
CM1425−03CP CSP−9 3500/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 3
1
Publication Order Number:
CM1425/D
http://www.Datasheet4U.com
1 page  
CM1425
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance − Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
Value
0.240 mm
Round
Non−Solder Mask defined pads
0.290 mm Round
0.125 − 0.150 mm
0.300 mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
±50 mm
±20 mm
60 seconds
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 3. Recommended Non−Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CM1425.PDF ] | |
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