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PDF LTC3212 Data sheet ( Hoja de datos )
| Número de pieza | LTC3212 | |
| Descripción | RGB LED Driver and Charge Pump | |
| Fabricantes | Linear Technology | |
| Logotipo |  |
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Features
■ Power and Current Control for Driving RGB LEDs
■ Individually Programmable Current Sources
■ 1x or 2x Mode, Low Noise, Constant Frequency
Charge Pump
■ Single Wire Enable Control for All LEDs
■ White Mode Adjusts R, G, B Currents for White Light
■ 25mA Maximum LED Current
■ VIN Range: 2.7V to 5.5V
■ Automatic Soft-Start, Mode Switching and Output
Disconnect in Shutdown Mode
■ Available in 12-Lead (3mm × 2mm) DFN Package
Applications
■ Cellular Phones
■ Media Players
■ RGB Back Lights
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents, including 6411531.
LTC3212www.DataSheet4U.com
RGB LED Driver and
Charge Pump
Description
The LTC®3212 is a low noise charge pump RGB LED
driver capable of driving three LEDs up to 25mA each
from a 2.7V to 5.5V input. Low external part count (one
flying capacitor, two bypass capacitors and one to three
programming resistors) makes the LTC3212 ideally suited
for small, battery-powered applications.
Built-in soft-start circuitry prevents excessive inrush cur-
rent during start-up and mode switching. High switching
frequency enables the use of small external capacitors.
The charge pump shuts down to a high impedance mode
to prevent LED leakage while the LTC3212 is off.
Each LED may be individually turned on or off via a single
pin interface. The current through the LEDs may be indi-
vidually programmed with resistors or may share a single
programming resistor. White mode adjusts the red, green
and blue LED current ratios for a white light when all three
LEDs are programmed to be on.
LED currents are regulated using internal low dropout
current sources. Automatic mode switching optimizes
efficiency by monitoring the LED current drivers and
switches mode only when dropout is detected. The part
is available in a 3mm × 2mm 12-lead DFN package.
Typical Application
RGB Power Supply and Current Control
1µF
VIN
2.7V TO 5.5V
1µF
11.8k
CM CP
VIN CPO
LTC3212
LEDR
LEDEN
LEDG
ISETB
ISETR
ISETG
LEDB
R
GB
1µF
LEDR
LEDG
LEDB
INDIVIDUAL WHITE
SETTINGS MODE
15mA
15mA
15mA
13.5mA
15mA
11.2mA
3212 TA01a
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1 page  
LTC3212www.DataSheet4U.com
Pin Functions
CP, CM (Pins 1, 11): Charge Pump Flying Capacitor Pins.
A 1µF X5R or X7R ceramic capacitor should be connected
from CP to CM.
CPO (Pin 2): CPO is the output of the charge pump. A 1µF
X5R or X7R ceramic capacitor is required from CPO to
GND. While operating, this pin will supply current to the
LEDs and while in shutdown mode this pin will be high
impedance.
LEDEN (Pin 3): The LEDEN pin is used to program, enable
and shut down the part. A 3µA internal current source
pulls this pin to ground.
ISETB, ISETR, ISETG (Pins 4, 5, 6): LED current program-
ming resistor pins. A resistor connected between a pin
and GND is used to set the LED current. A resistor from
ISETG to GND is required. Resistors on ISETR and ISETB
are optional. If ISETR and/or ISETB is not connected to a
resistor ISETR’s and/or ISETB’s respective output(s) will be
automatically programmed by the resistor connected to
ISETG. If ISETR or ISETB is unused the pin should be con-
nected to VIN.
LEDG, LEDR, LEDB (Pins 7, 8, 9): These pins are
the LED current output pins. The LEDs are connected
from either the charge pump or VIN (anode) to LED
(R, G, B) (cathode).
GND (Pin 10): This pin should be connected directly to a
low impedance ground plane.
VIN (Pin 12): Supply voltage for the LTC3212. VIN should
be bypassed with a low impedance ceramic capacitor to
GND of at least 1µF of capacitance.
Exposed Pad (Pin 13): GND. The Exposed Pad must be
soldered to a low impedance ground plane for optimum
performance.
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5 Page 
Package Description
DDB Package
12-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1723 Rev Ø)
LTC3212www.DataSheet4U.com
0.64 ±0.05
(2 SIDES)
2.55 ±0.05
1.15 ±0.05
0.70 ±0.05
0.25 ± 0.05
PACKAGE
OUTLINE
0.45 BSC
2.39 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 ±0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
7
0.40 ± 0.10
12
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.64 ± 0.10
(2 SIDES) 6
0.23 ± 0.05
PIN 1
R = 0.20 OR
0.25 × 45°
1 CHAMFER(DDB12) DFN 0106 REV Ø
0.45 BSC
0 – 0.05
2.39 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LTC3212.PDF ] | |
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