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PDF LTC3539 Data sheet ( Hoja de datos )

Número de pieza LTC3539
Descripción 1MHz/2MHz Synchronous Step-Up DC/DC Converters
Fabricantes Linear Technology 
Logotipo Linear Technology Logotipo



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No Preview Available ! LTC3539 Hoja de datos, Descripción, Manual

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LTC3539/LTC3539-2
2A, 1MHz/2MHz
Synchronous Step-Up
DC/DC Converters
FEATURES
n Delivers 3.3V at 900mA From 2 Alkaline/NiMH Cells
n Delivers 5V at 900mA From a Lithium-Polymer
Battery
n VIN Start-Up Voltage: 700mV
n 1.5V to 5.25V VOUT Range
n Up to 94% Efficiency
n VIN > VOUT Operation
n 1MHz (LTC3539) or 2MHz (LTC3539-2) Fixed
Frequency Operation
n Output Disconnect
n Selectable Burst Mode® or PWM Operation
n 10μA Quiescent Current
n Logic Controlled Shutdown: <1μA
n Requires Only 6 External Components
n Low Profile (2mm × 3mm × 0.75mm) DFN Package
APPLICATIONS
n Medical Instruments
n Portable Bar Code Scanners
n Noise Canceling Headphones
n Portable GPS Navigation
n Handheld PCs
DESCRIPTION
The LTC®3539/LTC3539-2 are synchronous, 2A step-up
DC/DC converters with output disconnect. Synchronous
rectification enables high efficiency in the low profile
2mm × 3mm DFN package. Battery life is extended with
a 700mV start-up voltage and operation down to 500mV
once started.
A switching frequency of 1MHz (LTC3539) or 2MHz
(LTC3539-2) minimizes solution footprint by allowing the
use of tiny, low profile inductors and ceramic capacitors.
The current mode PWM design is internally compensated,
reducing external parts count. The LTC3539/LTC3539-2
feature a pin-enabled automatic Burst Mode operation at
light load conditions. Anti-ring circuitry reduces EMI by
damping the inductor in discontinuous mode. Additional
features include a low shutdown current of under 1μA and
thermal overload protection.
The LTC3539/LTC3539-2 are offered in a 2mm × 3mm ×
0.75mm DFN package.
L, LT, LTC, LTM and Burst Mode are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
Wide VIN, High Power 3.3V Regulator
VIN
1.8V TO 3.6V
2.2μF
4.7μH
PWM BURST
VIN SW
LTC3539
MODE
VOUT
OFF ON SHDN
FB
1M
22pF
GND PGND
562k
VOUT
3.3V
600mA
22μF
3539 TA01a
Efficiency and Power Loss vs
Load Current
100 1000
90
80 EFFICIENCY
70
100
60
50
VIN = 2.4V
VOUT = 3.3V
40
30
20
POWER LOSS
10
1
10
0
0.1
FREQUENCY = 1MHz
FREQUENCY = 2MHz
0.1
1 10 100 1000
ILOAD AVERAGE (mA)
3539 TA01b
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TYPICAL PERFORMANCE CHARACTERISTICS
LTC3539/LTC3539-2
RDS(ON) vs VOUT
0.30
0.25
0.20
PMOS
0.15
0.10
NMOS
0.05
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VOUT (V)
3539 G07
RDS(ON) Change vs Temperature
1.3
1.2
1.1
1.0
0.9
0.8
0.7
–50 –30 –10 10 30 50
TEMPERATURE (°C)
70 90
3539 G08
VFB vs Temperature
0.50
0.25
0
–0.25
–0.50
–0.75
–1.00
–60 –40 –20 0 20 40 60
TEMPERATURE (°C)
80 100
3539 G09
Start-Up Voltage vs Temperature
0.80
0.75
1mA LOAD
0.70
0.65
NO LOAD
0.60
0.55
Fixed Frequency SW and IL(AC)
Burst Mode SW and IL(AC)
SW PIN
2V/DIV
VOUT
20mV/DIV
AC-COUPLED
INDUCTOR
CURRENT
500mA/DIV
500ns/DIV
VIN = 2.4V
VOUT = 3.3V AT 400mA
COUT = 22μF
SW PIN
5V/DIV
VOUT
20mV/DIV
AC-COUPLED
3539 G12
INDUCTOR
CURRENT
200mA/DIV
VIN = 3.3V
VOUT = 5V
COUT = 22μF
5μs/DIV
0.50
–50
–25 0 25 50
TEMPERATURE (°C)
75 100
3539 G10
3539 G13
Load Step, Fixed Frequency
VOUT
50mV/DIV
AC-COUPLED
LOAD
CURRENT
200mA/DIV
500μs/DIV
VIN = 2.4V
VOUT = 3.3V
COUT = 22μF
ILOAD = 100mA TO 250mA STEP
3539 G14
Load Step, Burst Mode Operation
VOUT
50mV/DIV
AC-COUPLED
LOAD
CURRENT
200mA/DIV
500μs/DIV
VIN = 2.4V
VOUT = 3.3V
COUT = 22μF
ILOAD = 20mA TO 170mA
3539 G15
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LTC3539 arduino
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LTC3539/LTC3539-2
PACKAGE DESCRIPTION
DCB Package
8-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1718 Rev A)
3.50 ±0.05
2.10 ±0.05
0.70 ±0.05
1.35 ±0.05
1.65 ± 0.05
PACKAGE
OUTLINE
1.35 REF
0.25 ± 0.05
0.45 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.00 ±0.10
(2 SIDES)
R = 0.115
R = 0.05
TYP
TYP
5
0.40 ± 0.10
8
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
1.35 ±0.10
1.65 ± 0.10
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
(DCB8) DFN 0106 REV A
41
0.23 ± 0.05
0.45 BSC
1.35 REF
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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