PDF MC10H179 Data sheet ( Hoja de datos )

Número de pieza	MC10H179
Descripción	Look-Ahead Carry Block
Fabricantes	ON Semiconductor
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No Preview Available ! www.DataSheet4U.com MC10H179 Look−Ahead Carry Block The MC10H179 is a functional/pinout duplication of the standard MECL 10K part, with 100% improvement in propagation delay and no increase in power supply current. • Power Dissipation, 300 mW Typical • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K−Compatible DIP PIN ASSIGNMENT VCC1 GG CN+4 G0 G3 CN+2 G1 VEE 1 2 3 4 5 6 7 8 16 VCC2 15 PG 14 P0 13 P3 12 P2 11 CN 10 P1 9 G2 Pin assignment is for Dual−in−Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). http://onsemi.com CDIP−16 L SUFFIX CASE 620 PDIP−16 P SUFFIX CASE 648 PLCC−20 FN SUFFIX CASE 775 MARKING DIAGRAMS 16 MC10H179L AWLYYWW 1 16 MC10H179P AWLYYWW 1 1 10H179 AWLYYWW A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week ORDERING INFORMATION Device Package Shipping MC10H179L CDIP−16 25 Units/Rail MC10H179P PDIP−16 25 Units/Rail MC10H179FN PLCC−20 46 Units/Rail © Semiconductor Components Industries, LLC, 2000 June, 2006 − Rev. 7 1 Publication Order Number: MC10H179/D 1 page MC10H179 PACKAGE DIMENSIONS PLCC−20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775−02 ISSUE C B 0.007 (0.180) M T L−M S N S −N− Y BRK D U 0.007 (0.180) M T L−M S N S −L− −M− Z W 20 1 V D X G1 0.010 (0.250) S T L−M S N S VIEW D−D A 0.007 (0.180) M T L−M S N S Z R 0.007 (0.180) M T L−M S N S K1 H 0.007 (0.180) M T L−M S N S CE G G1 0.010 (0.250) S T L−M S 0.004 (0.100) J −T− SEATING PLANE VIEW S NS K F VIEW S 0.007 (0.180) M T L−M S N S NOTES: 1. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 −−− 0.51 −−− K 0.025 −−− 0.64 −−− R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y −−− 0.020 −−− 0.50 Z 2_ 10_ 2 _ 10 _ G1 0.310 0.330 7.88 8.38 K1 0.040 −−− 1.02 −−− http://onsemi.com 5 5 Page

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