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PDF LTC5533 Data sheet ( Hoja de datos )
| Número de pieza | LTC5533 | |
| Descripción | Precision Dual RF Power Detector | |
| Fabricantes | Linear Technology | |
| Logotipo |  |
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LTC5533
300MHz to 11GHz Precision
Dual RF Power Detector
FEATURES
■ Two Independent Temperature Compensated
Schottky Diode RF Peak Detectors
■ 45dB Channel-to-Channel Isolation at 2GHz
■ Wide Input Frequency Range: 300MHz to 11GHz*
■ Wide Input Power Range: –32dBm to 12dBm
■ Buffered Detector Outputs with Gain of 2x
■ Adjustable VOUT Starting Voltage
■ Wide VCC Range of 2.7V to 6V
■ Low Operating Current: <500µA/Channel
■ Low Shutdown Current: <2µA/Channel
■ 4mm × 3mm DFN Package
U
APPLICATIO S
■ PA Forward and Reverse Power Monitor
■ Dual PA Transmit Power Control
■ 802.11a, b, g, 802.15, WiMAX
■ PA Linearization
■ Fixed Wireless Access
■ RF Power Alarm
■ Envelope Detector
DESCRIPTIO
The LTC®5533 is a dual channel RF power detector for RF
applications operating in the 300MHz to 11GHz range.
Two independent temperature compensated Schottky di-
ode peak detectors and buffer amplifiers are combined in
a small 4mm × 3mm DFN package.
The RF input voltage is peak detected using on-chip
Schottky diodes. The detected voltage is buffered and
supplied to the VOUT pins. A power saving shutdown mode
reduces current to less than 2µA/channel. The initial
output starting voltages can be precisely adjusted using
the VOS pins.
The LTC5533 operates with input power levels from
–32dBm to 12dBm.
, LTC and LT are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
*Higher frequency operation is achievable with reduced performance. Consult factory for more
information.
TYPICAL APPLICATIO
VCC
0.1µF
300MHz to 11GHz RF Power Detectors
100pF
VOS1
100pF
VOS2
LTC5533
VCC1 RFIN1
VOUT1 GND1
VOS1 SHDN1
VCC2 RFIN2
VOUT2 GND2
VOS2 SHDN2
(EXPOSED PAD)
39pF
RF1 INPUT
39pF
RF2 INPUT
DISABLE ENABLE
5533 TA01
Output Voltage vs RF Input Power
3600
3200
2800
VCC = 3.6V
VOS = 0V
TA = 25°C
2400
2000
1600
1200
800
400
4GHz
1GHz
5GHz
500MHz
6GHz
8GHz
11GHz
10GHz
9GHz
0
–28 –24 –20 –16 –12 –8 –4 0 4
RF INPUT POWER (dBm)
8 12
5533 TA02
5533f
1
1 page  
LTC5533
TYPICAL PERFOR A CE CHARACTERISTICS (For one channel. SHDN = VCC, unless
otherwise specified.)
VOUT Variation Relative to 25°C
vs RF Input Power at 3GHz
3
VCC = 3.6V
VOS = 0V
2
1 TA = –40°C
VOUT Variation Relative to 25°C
vs RF Input Power at 5GHz
3
VCC = 3.6V
VOS = 0V
2
TA = –40°C
1
VOUT Variation Relative to 25°C
vs RF Input Power at 7GHz
3
VCC = 3.6V
VOS = 0V
2
TA = –40°C
1
00 0
–1 TA = 85°C
–2
–1
TA = 85°C
–2
–1
TA = 85°C
–2
–3
–30 –26 –22 –18 –14 –10 –6 –2 2
RF INPUT POWER (dBm)
6
5533 G19
Example VOUT1 – VOUT2 Mismatch
with No RF Signal Input
25 VCC = 3.6V
VOS = 0V
20 TA = 25°C
15
10
5
0
–25 –20 –15 –10 –5 0 5 10 15 20 25
VOUT1 – VOUT2 MISMATCH (mV)
5533 G22
VOUT vs RF Input Power and VOS,
fRF = 2GHz
3600
VCC = 3.6V
3200 TA = 25°C
2800
2400
2000
1600
1200
800
400
VOS = 1V
VOS = 0.75V
VOS = 0.5V
VOS = 0V
VOS = 0.25V
0
–32 –28 –24 –20 –16 –12 –8 –4 0 4 8 12
RF INPUT POWER (dBm)
5533 G25
–3
–28 –24 –20 –16 –12 –8 –4 0
RF INPUT POWER (dBm)
48
5533 G20
Example VOUT1 – VOUT2 Mismatch
with –14dBm RF Signal Input at
1.8GHz
25 VCC = 3.6V
VOS = 0V
20 TA = 25°C
15
10
5
0
–1 –0.8–0.6–0.4–0.2 0 0.2 0.4 0.6 0.8 1
VOUT1 – VOUT2 MISMATCH (dB)
5533 G23
Channel-to-Channel Isolation vs
RF Input Frequency
–20
CH. 2 CH. 1
–30
–40
CH. 1 CH. 2
–50
VCC = 3.6V
–60 VOS = 0V
TA = 25°C
RF PIN = +10dBm
–70
0 2000 4000
6000
8000
10000 12000
RF INPUT FREQUENCY (MHz)
5533 G26
–3
–26 –22 –18 –14 –10 –6 –2 2
RF INPUT POWER (dBm)
6 10
5533 G21
VOUT vs RF Input Power and VCC
Supply Voltage, fRF = 2GHz
6000
5500
5000
VOS = 0V
TA = 25°C
VCC = 6V
VCC = 5V
4500
4000
3500
VCC = 4V
3000
VCC = 3V
2500
2000
1500
1000
500
0
–32 –28 –24 –20 –16 –12 –8 –4 0 4 8 12
RF INPUT POWER (dBm)
5533 G24
Output Delay vs RF Input Power
1000
900
800
VCC = 3.6V
VOS = 0V
TA = 25°C
700
600
500
400
90% SWITCHING
300
200
100
–20
50% SWITCHING
–16 –12 –8 –4 0 4
RF INPUT POWER (dBm)
8
5533 G27
5533f
5
5 Page 
PACKAGE DESCRIPTIO
DE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
LTC5533
0.65 ±0.05
3.50 ±0.05
1.70 ±0.05
2.20 ±0.05 (2 SIDES)
PACKAGE OUTLINE
0.25 ± 0.05
0.50
BSC
3.30 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ±0.10
(2 SIDES)
R = 0.20
TYP
R = 0.115
7 TYP
0.38 ± 0.10
12
PIN 1
TOP MARK
(NOTE 6)
3.00 ±0.10 1.70 ± 0.10
(2 SIDES) (2 SIDES)
0.200 REF
0.75 ±0.05
0.00 – 0.05
61
0.25 ± 0.05
0.50
BSC
3.30 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
NOTCH
(UE12/DE12) DFN 0603
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5533f
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LTC5533.PDF ] | |
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