|
|
PDF MCR22-8 Data sheet ( Hoja de datos )
| Número de pieza | MCR22-8 | |
| Descripción | (MCR22-6 / -8) SENSITIVE GATE SILICON CONTROLLED RECTIFIERS | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de MCR22-8 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
|
No Preview Available !
MCR22-6, MCR22-8
Preferred Device
Sensitive Gate
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed and tested for repetitive peak operation required for CD
ignition, fuel ignitors, flash circuits, motor controls and low−power
switching applications.
Features
• 150 A for 2 ms Safe Area
• High dv/dt
• Very Low Forward “On” Voltage at High Current
• Low−Cost TO−226 (TO−92)
• Pb−Free Packages are Available*
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value
Peak Repetitive Off−State Voltage (Note 1)
(RGK = IK, TJ = *40 to +110°C, Sine Wave,
50 to 60 Hz, RGK = 1kW)
MCR22−6
MCR22−8
VDRM,
VRRM
400
600
On−State Current RMS
(180° Conduction Angles, TC = 80°C)
IT(RMS)
1.5
Peak Non−repetitive Surge Current,
@TA = 25°C, (1/2 Cycle, Sine Wave, 60 Hz)
Circuit Fusing Considerations (t = 8.3 ms)
ITSM
I2t
15
0.9
Forward Peak Gate Power
(Pulse Width ≤ 1.0 msec, TA = 25°C)
PGM
0.5
Forward Average Gate Power
(t = 8.3 msec, TA = 25°C)
PG(AV)
0.1
Forward Peak Gate Current
(Pulse Width ≤ 1.0 ms, TA = 25°C)
IFGM
0.2
Reverse Peak Gate Voltage
(Pulse Width ≤ 1.0 ms, TA = 25°C)
VRGM
5.0
Operating Junction Temperature Range
@ Rated VRRM and VDRM
TJ −40 to +110
Storage Temperature Range
THERMAL CHARACTERISTICS
Tstg −40 to +150
Unit
V
A
A
A2s
W
W
A
V
°C
°C
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
Lead Solder Temperature
(Lead Length q 1/16″ from case, 10 S Max)
RqJC
RqJA
TL
50
160
+260
°C/W
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. aVpDpRlMy faonrdzeVrRoRoMr nfoergaaltlitvyepgeastceavnolbteagaep;phlioewdeovnear,cpoonstiitnivueoguastbeavsoilsta. Rgeatsinhgasll
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2008
November, 2008 − Rev. 6
1
http://onsemi.com
SCRs
1.5 AMPERES RMS
400 thru 600 VOLTS
G
AK
123
12 3
STRAIGHT LEAD
BULK PACK TO−92 (TO−226)
CASE 029
STYLE 10
BENT LEAD
TAPE & REEL
AMMO PACK
MARKING DIAGRAMS
MCR
22−x
AYWW G
G
MCR22−x =
A=
Y=
WW =
G=
Device Code
x = 6 or 8
Assembly Location
Year
Work Week
Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
1 Cathode
2 Gate
3 Anode
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MCR22−6/D
1 page  
MCR22−6, MCR22−8
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A H2A
H2B H2B
H
H4 H5
W2
L1 H1
W1 W
L
F1
F2
P2 P2
D
P1
P
Figure 9. Device Positioning on Tape
T1
T
T2
Specification
Inches
Millimeter
Item
Symbol
Min
Max
Min
Max
Tape Feedhole Diameter
D
0.1496
0.1653
3.8
4.2
Component Lead Thickness Dimension
D2
0.015
0.020
0.38
0.51
Component Lead Pitch
F1, F2
0.0945
0.110
2.4
2.8
Bottom of Component to Seating Plane
H
.059
.156
1.5
4.0
Feedhole Location
H1
0.3346
0.3741
8.5
9.5
Deflection Left or Right
H2A 0 0.039 0
1.0
Deflection Front or Rear
H2B 0 0.051 0
1.0
Feedhole to Bottom of Component
H4
0.7086
0.768
18
19.5
Feedhole to Seating Plane
H5
0.610
0.649
15.5
16.5
Defective Unit Clipped Dimension
L
0.3346
0.433
8.5
11
Lead Wire Enclosure
L1 0.09842
−
2.5
−
Feedhole Pitch
P
0.4921
0.5079
12.5
12.9
Feedhole Center to Center Lead
P1
0.2342
0.2658
5.95
6.75
First Lead Spacing Dimension
P2
0.1397
0.1556
3.55
3.95
Adhesive Tape Thickness
T
0.06
0.08
0.15
0.20
Overall Taped Package Thickness
T1
− 0.0567 −
1.44
Carrier Strip Thickness
T2
0.014
0.027
0.35
0.65
Carrier Strip Width
W
0.6889
0.7481
17.5
19
Adhesive Tape Width
W1
0.2165
0.2841
5.5
6.3
Adhesive Tape Position
W2
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet MCR22-8.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MCR22-2 | Silicon Controlled Rectifiers |  Motorola Semiconductors |
| MCR22-2 | Thyristor SCR 50V 15A 3-Pin TO-92 |  New Jersey Semiconductor |
| MCR22-2 | SILICON CONTROLLED RECTIFIERS |  Digitron Semiconductors |
| MCR22-2 | Thyristor |  BLUE ROCKET ELECTRONICS |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |