PDF LP5526 Data sheet ( Hoja de datos )

Número de pieza	LP5526
Descripción	Lighting Management Unit with High Voltage Boost Converter
Fabricantes	National Semiconductor
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No Preview Available ! www.DataSheet4U.com March 2006 LP5526 Lighting Management Unit with High Voltage Boost Converter with up to 150mA Serial FLASH LED Driver General Description LP5526 is a Lighting Management Unit for portable applica- tions. It is used to drive display backlights, keypad LEDs, RGB LEDs and camera flash LEDs. LP5526 can drive 2 separately connected strings of LEDs with high voltage boost converter. The RGB driver allows driving either indi- vidual color LEDs or RGB LED from separate supply power, or it can be used to drive series connecter flash LEDs from high voltage boost converter. The backlight drivers (MAIN and SUB pins) are both high resolution constant current mode drivers. The flash outputs can drive series connected flash LED with up to 150mA of current. External PWM control can be used for dimming any selected LED outputs or it can be used to trigger the flash. The flash has also 1-second safety timer. The device is controlled through 2-wire low voltage I2C compatible interface that reduces the number of required connections. Features n High efficiency boost converter with programmable output voltage up to 20V n 2 individual drivers for serial display backlight LEDs n Automatic dimming controller n Stand alone RGB controller n Dedicated flash function n Safety function to avoid prolonged flash n 3 general purpose IO pins n 25-bump micro SMD Package: (2.54mm x 2.54mm x 0.6mm) Applications n Cellular Phones and PDAs n MP3 Players n Digital Cameras Typical Application DataSheet4U.com DataShee DataSheet4U.com © 2006 National Semiconductor Corporation DS201797 20179770 www.national.com 1 page www.DataSheet4U.com Electrical Characteristics (Notes 2, 8) Limits in standard typeface are for TJ = 25o C. Limits in boldface type apply over the operating ambient temperature range (-30oC < TA < +85oC). Unless otherwise noted, specifications apply to the LP5526 Block Diagram with: VDD1,2 = 3.0 ... 5.5V, CVDD = CVDDIO = 100nF, COUT = 2 x 4.7µF, CIN = 10µF, CVDDA = 1µF, CVREF = 100nF, L1 = 10µH, RRGB = 2.4kΩ and RRT = 82kΩ (Note 9). Symbol Parameter Condition Min Typ Max Units IVDD VDDA Standby supply current (VDD1, VDD2) No-boost supply current (VDD1, VDD2) No-load supply current (VDD1, VDD2) Output voltage of internal LDO NSTBY = L Register 0DH=08H (Note 10) NSTBY = H, EN_BOOST = L NSTBY = H, EN_BOOST = H Autoload OFF IVDDA = 1mA 1.7 7 300 800 780 1300 2.80 -3 +3 µA µA uA V % VREF Reference voltage (Note 11) 1.23 V et4U.com Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All voltages are with respect to the potential at the GND pins. Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150oC (typ.) and disengages at TJ=130oC (typ.). Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN1112 : Micro SMD Wafer Level Chip Scale Package Note 5: The Human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. MIL-STD-883 3015.7 Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125oC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA x PD-MAX). Note 7: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. Note 8: Min and Max limits are guaranteed by design, test, or statistical DanaalytasisS. Thyepiecatl4nUum.cbeorsmare not guaranteed, but do represent the most likely norm. Note 9: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. Note 10: Boost output voltage set to 8V (08H in register 0DH) to prevent any unneccessary current consumption. Note 11: No external loading allowed for VREF pin. DataShee DataSheet4U.com 5 www.national.com 5 Page www.DataSheet4U.com Boost Converter Typical Performance Characteristics (Continued) Boost Load Transient Response 50mA – 150mA Autoload Effect on Input Current, No Load 20179785 Boost Maximum Current vs. Output Voltage et4U.com DataSheet4U.com 20179795 20179786 DataShee DataSheet4U.com 11 www.national.com 11 Page

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