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PDF LTC3214 Data sheet ( Hoja de datos )
| Número de pieza | LTC3214 | |
| Descripción | 500mA Camera LED Charge Pump | |
| Fabricantes | Linear Technology | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de LTC3214 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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FEATUREtSaSheet4U.com DESCRIPTIOLED50C0mhaArgCLeTaCPm3u2em1rap4■ Low Noise Constant Frequency Operation*
a■ High Efficiency: Up to 94%
.D■ Multi-Mode Operation: 1x, 1.5x or 2x Boost Modes
w■ Automatic Mode Switching
w■ High Output Current: Up to 500mA
w■ Tiny Application Circuit (3mm × 3mm DFN Package,
mAll Components <1mm High)
o■ Automatic Soft-Start
.c■ Output Disconnect
■ Open, Shorted LED Protection
■ No Inductors
U■ Internal 110mΩ LED Current Sense Resistor
t4■ 3mm × 3mm 10-Lead DFN Package
APPLICATIOUS ee■ LED Torch/Camera Light Supply for Cell Phones,
hPDAs and Digital Cameras
S■ General Lighting and/or Flash/Strobe Applications
The LTC®3214 is a low noise, high current charge pump
DC/DC converter capable of driving high current LEDs at
up to 500mA from a 2.9V to 4.5V input. Low external
parts count (two flying capacitors, one programming
resistor and two bypass capacitors at VIN and CPO) make
the LTC3214 ideally suited for small, battery-powered
applications.
Built-in soft-start circuitry prevents excessive inrush cur-
rent during start-up. High switching frequency enables the
use of small external capacitors.
Output current level is programmed by an external resis-
tor. LED current is regulated using an internal 110mΩ
sense resistor. Automatic mode switching optimizes effi-
ciency by monitoring the voltage across the charge pump
and switching modes only when dropout is detected. The
part is available in a low profile 3mm x 3mm 10-lead DFN
package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
*Protected by U.S. Patents including 6411531.
TYPICAL APPLICATIO .DataC1
2.2µF
C2
2.2µF
ww2.9V TO 4.5V
CIN
m2.2µF
w www.DataSheet4U.c1oDISABLE ENABLE
C1+ C1– C2+ C2–
VIN CPO
LTC3214
ILED
EN
ISET
0.11Ω
RSET
3214 TA01a
LED: AOT2015
LED
ILED
UP TO
500mA
CCPO
4.7µF
Efficiency vs VIN
100
100mA 200mA
90 300mA
80
70
60 50mA
50
40
30
20
10 LED = AOT2015
VF = 2.9V TYP AT 100mA
0
2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5
VIN (V)
3214 TA01b
3214f
1 page  
LTC3214
PI FU CTIO S
C2+, C1+, C2–, C1– (Pins 1, 2, 8, 10): Charge Pump Flying
Capacitor Pins. A 2.2µF X5R or X7R ceramic capacitor
should be connected from C1+ to C1– and from C2+ to
C2–.
CPO (Pin 3): Output. CPO is the output of the charge
pump. This pin may be enabled or disabled using the EN
input. A 4.7µF X5R or X7R ceramic capacitor is required
from CPO to GND.
ILED (Pin 4): Input. ILED is the LED current sense pin. The
LED is connected between CPO (anode) and ILED (cath-
ode). The current into the ILED pin is set by a resistor
connected to the ISET pin and regulated internally.
ISET (Pin 5): LED Current Programming Resistor Pin. A
resistor connected between this pin and GND is used to set
the LED current level.
EN (Pin 6): Input. The EN pin is used to enable the part and
bring it into shutdown mode. An internal 250kΩ resistor
pulls this pin to GND when left floating.
VIN (Pin 7): Power. Supply voltage for the LTC3214. VIN
should be bypassed with a 2.2µF to 4.7µF low impedance
ceramic capacitor to GND.
GND (Pin 9): Charge Pump Ground. This pin should be
connected directly to a low impedance ground plane.
Exposed Pad (Pin 11): Control Signal Ground. This pad
must be soldered to a low impedance ground plane for
optimum thermal and electrical performance.
BLOCK DIAGRA
2
C1+
10
C1–
1
C2+
8
C2–
OSCILLATOR
VIN
7
EN
6
CONTROL
LOGIC
250k
GND
9
–
+
MODE
CONTROL
CPO
3
VOLTAGE
CLAMP
VREF
CURRENT
SOURCE
CONTROL
VIN ILED 4
58Ω 0.11Ω
ISET
5
GND
11
3214 BD
3214f
5
5 Page 
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
LTC3214
0.675 ±0.05
3.50 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.115
TYP
6
0.38 ± 0.10
10
3.00 ±0.10 1.65 ± 0.10
(4 SIDES) (2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.75 ±0.05
0.00 – 0.05
(DD10) DFN 1103
51
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3214f
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LTC3214.PDF ] | |
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