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Número de pieza | LTC3215 | |
Descripción | 700mA Low Noise High Current LED Charge Pump | |
Fabricantes | Linear Technology | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de LTC3215 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
No Preview Available ! FEATUREtSaSheet4U.com DCEuSCrr7ReI0Pn0TtImOLEADLoCwhaNrgoLeiTseCP3uH2mig1ph5■ High Efficiency Operation: 1x, 1.5x or 2x Boost
aModes with Automatic Mode Switching
.D■ Ultralow Dropout ILED Current Control
w■ Output Current up to 700mA
w■ Low Noise Constant Frequency Operation*
w■ Wide VIN Range: 2.9V to 4.4V
m■ Open/Shorted LED Protection
o■ LED Disconnect in Shutdown
.c■ Low Shutdown Current: 2.5µA
■ 4% LED Current Programming Accuracy
■ Automatic Soft-Start Limits Inrush Current
U■ No Inductors
t4■ Tiny Application Circuit (All Components <1mm
Profile)
e■ 3mm × 3mm 10-Lead DFN Package
APPLICATIOUS he■ LED Torch/Camera Light Supply for Cell Phones,
SPDAs and Digital Cameras
ta■ General Lighting and/or Flash/Strobe Applications
The LTC®3215 is a low noise, high current charge pump
DC/DC converter designed to power high current LEDs.
The part includes an accurate programmable current
source capable of driving loads up to 700mA from a 2.9V
to 4.4V input. Low external parts count (two flying capaci-
tors, one programming resistor and two bypass capaci-
tors) makes the LTC3215 ideally suited for small, battery-
powered applications.
Built-in soft-start circuitry prevents excessive inrush cur-
rent during start-up. High switching frequency enables the
use of small external capacitors. LED current is pro-
grammed with an external resistor. The LED is discon-
nected from VIN during shutdown.
An ultralow dropout current source maintains accurate
LED current at very low ILED voltages. Automatic mode
switching optimizes efficiency by monitoring the voltage
across the LED current source and switching modes only
when ILED dropout is detected. The LTC3215 is available in
a low profile 3mm × 3mm 10-Lead DFN package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
*Protected by U.S. Patent 6411531.
TYPICAL APPLICATIO .DaC1
w2.2µF
C2
2.2µF
w m2.9V TO 4.4V
w oCIN
.c2.2µF
www.DataSheet4U 1DISABLE ENABLE
C1+ C1– C2+ C2–
VIN CPO
LTC3215
ILED
EN
ISET
20k
1%
3215 TA01a
LED1: AOT2015 HPW 1751B
LED1
ILED
200mA
CCPO
4.7µF
Efficiency vs VIN
100
90
ILED = 200mA
80
70
60
50
40
30
20
10 LED = AOT2015 HPW 1751B
VF = 3V TYP AT 200mA
0
2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4
VIN (V)
3215 TA01b
3215f
1 page LTC3215
PI FU CTIO S
C2+, C1+, C2–, C1– (Pins 1, 2, 8, 10): Charge Pump
Flying Capacitor Pins. A 2.2µF X5R or X7R ceramic
capacitor should be connected from C1+ to C1– and from
C2+ to C2–.
CPO (Pin 3): Output. CPO is the output of the Charge
Pump. This pin may be enabled or disabled using the EN
input. A 4.7µF X5R or X7R ceramic capacitor is required
from CPO to GND.
ILED (Pin 4): Output. ILED is the LED current source output.
The LED is connected between CPO (anode) and ILED
(cathode). The current into the ILED pin is set by the
programming resistor connected from ISET to GND.
ISET (Pin 5): LED Current Programming Resistor Pin. The
ISET pin will servo to 1.22V. A resistor connected between
this pin and GND is used to set the LED current level.
Connecting a resistor of 2k or less will cause the LTC3215
to enter overcurrent shutdown mode.
EN (Pin 6): Input. The EN is used to enable the part or put
it into shutdown mode.
VIN (Pin 7): Power. Supply voltage for the LTC3215. VIN
should be bypassed with a 2.2µF or greater low impedance
ceramic capacitor to GND.
GND (Pin 9): Charge Pump Ground. This pin should be
connected directly to a low impedance ground plane.
EXPOSED PAD (Pin 11): Control Signal Ground. This pad
must be soldered to a low impedance ground plane for
optimum thermal and electrical performance.
BLOCK DIAGRA
2
C1+
10
C1–
1
C2+
8
C2–
OSCILLATOR
VIN
7
EN
6
CONTROL
LOGIC
GND
9
1X MODE: CPO = VIN
1.5X MODE: CPO = 4.6V
2X MODE: CPO = 5.1V
–
+ VREF
CPO 3
MODE
CONTROL
DROPOUT
DETECTOR
ILED
4
CURRENT
SOURCE
CONTROL
ISET
5
GND
11
3215 BD
3215f
5
5 Page PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
LTC3215
0.675 ±0.05
3.50 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.115
TYP
6
0.38 ± 0.10
10
3.00 ±0.10 1.65 ± 0.10
(4 SIDES) (2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.75 ±0.05
0.00 – 0.05
(DD10) DFN 1103
51
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3215f
11
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet LTC3215.PDF ] |
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