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MC33269, NCV33269
800 mA, Adjustable Output,
Low Dropout Voltage
Regulator
The MC33269/NCV33269 series are low dropout, medium current,
fixed and adjustable, positive voltage regulators specifically designed
for use in low input voltage applications. These devices offer the
circuit designer an economical solution for precision voltage
regulation, while keeping power losses to a minimum.
The regulator consists of a 1.0 V dropout composite PNP−NPN pass
transistor, current limiting, and thermal shutdown.
Features
• 3.3 V, 3.5 V, 5.0 V, 12 V and Adjustable Versions
2.85 V version available as MC34268
• Space Saving DPAK, SO−8 and SOT−223 Power Packages
• 1.0 V Dropout
• Output Current in Excess of 800 mA
• Thermal Protection
• Short Circuit Protection
• Output Trimmed to 1.0% Tolerance
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These are Pb−Free Devices
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
MC33269D
NCV33269D*
MC33269DT
NCV33269DTRK*
MC33269T
MC33269D−3.3
MC33269DT−3.3
NCV33269DTRK−3.3*
MC33269T−3.3
MC33269ST−3.3
Adj
Adj
Adj
Adj
Adj
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
MC33269T−3.5
MC33269D−5.0
MC33269DT−5.0
NCV33269DT−5.0*
NCV33269DTRK−5.0*
MC33269T−5.0
MC33269D−012
MC33269DT−012
NCV33269DTRK−012*
MC33269T−012
3.5 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
12 V
12 V
12 V
12 V
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and
Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.
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1
SO−8
D SUFFIX
CASE 751
GND/Adj 1
8 NC
2
Vout
3
Vin 4
7
Vout
6
5 NC
(Top View)
1
3
DPAK
DT SUFFIX
CASE 369C
1. GND/Adj
2. Vout
3. Vin
12 3
(Top View)
1
3
SOT−223
ST SUFFIX
CASE 318E
123
(Top View)
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
TO−220AB
T SUFFIX
CASE 221AB
1
23
1. GND/Adj
2. Vout
3. Vin
12 3
(Top View)
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 28
1
Publication Order Number:
MC33269/D
MC33269, NCV33269
170 3.2
150 2.8
PD(max) for TA = 50°C
130 2.4
110 Graph represents symmetrical layout 2.0
ÏÏÏ ÏÏÏ90
L
2.0 oz.
Copper
1.6
ÏÏÏÏÏÏÏ70 1.2
ÏÏÏ ÏÏÏL 3.0mm
50 0.8
RqJA
30 0.4
0 10 20 30 40 50
L, LENGTH OF COPPER (mm)
Figure 8. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
100
Free Air
PD(max) for TA = 50°C
2.4
90 Mounted
2.0
Vertically
80
Minimum
70 Size Pad
60
2.0 oz. Copper
L 1.6
ÏÏÏÏÏÏ 1.2
L
ÏÏÏÏÏÏ 0.8
50 0.4
RqJA
40 0
0 5.0 10 15 20 25 30
L, LENGTH OF COPPER (mm)
Figure 9. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
280 2.50
Free Air
PD(max) for TA = 50°C
240 Mounted
1.25
Vertically
200
Minimum
160 Size Pad
120
2.0 oz. Copper
L 0.83
ÏÏÏÏL 0.63
ÏÏÏÏÏÏÏÏ0.50
80 0.42
RqJA
40 0.35
0
5.0 10
15
20
25 30
L, LENGTH OF COPPER (mm)
Figure 10. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
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MC33269, NCV33269
PACKAGE DIMENSIONS
D
b1
4
HE
1 23
e1
e
0.08 (0003)
A1
SOT−223
ST SUFFIX
CASE 318E−04
ISSUE N
E
b
Aq
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERS
INCHES
DIM MIN NOM MAX
MIN NOM MAX
A 1.50
1.63
1.75
0.060 0.064 0.068
A1 0.02
0.06
0.10
0.001 0.002 0.004
b 0.60 0.75 0.89 0.024 0.030 0.035
b1 2.90
3.06
3.20
0.115 0.121 0.126
c 0.24 0.29 0.35 0.009 0.012 0.014
D 6.30
6.50
6.70
0.249 0.256 0.263
E 3.30
3.50
3.70
0.130 0.138 0.145
e 2.20 2.30 2.40 0.087 0.091 0.094
e1 0.85
0.94
1.05
0.033 0.037 0.041
L 0.20 −−− −−− 0.008 −−−
−−−
L1 1.50
1.75
2.00
0.060 0.069 0.078
C
H E 6.70 7.00 7.30 0.264 0.276 0.287
q 0° − 10° 0° − 10°
L L1
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
ǒ ǓSCALE 6:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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