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PDF MC10H176 Data sheet ( Hoja de datos )
| Número de pieza | MC10H176 | |
| Descripción | Hex D Master-Slave Flip-Flop | |
| Fabricantes | ON Semiconductor | |
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MC10H176
Hex D Master−Slave
Flip−Flop
Description
The MC10H176 contains six master slave type D flip−flops with a
common clock. This MECL 10H™ part is a functional/pinout
duplication of the standard MECL 10K™ family part, with 100%
improvement in clock frequency and propagation delay and no
increase in power−supply current.
Features
• Propagation Delay, 1.7 ns Typical
• Power Dissipation, 460 mW Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K Compatible
• Pb−Free Packages are Available*
CLOCKED TRUTH TABLE
CQ
LX
H* L
H* H
Qn+1
Qn
L
H
* A clock H is a clock transition from
a low to a high state.
DIP
PIN ASSIGNMENT
VCC1
Q0
Q1
Q2
D0
D1
D2
VEE
1
2
3
4
5
6
7
8
16 VCC2
15 Q5
14 Q4
13 Q3
12 D5
11 D4
10 D3
9 CLOCK
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1
http://onsemi.com
MARKING DIAGRAMS*
CDIP−16
L SUFFIX
CASE 620A
16
MC10H176L
AWLYYWW
1
16
16
1
PDIP−16
P SUFFIX
CASE 648
MC10H176P
AWLYYWWG
1
10H176
ALYWG
SOEIAJ−16
CASE 966
1 20
20 1
PLLC−20
FN SUFFIX
CASE 775
10H176G
AWLYYWW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Publication Order Number:
MC10H176/D
1 page  
−L−
20
MC10H176
PACKAGE DIMENSIONS
−N− Y BRK
−M−
W
1
V
20 LEAD PLLC
CASE 775−02
ISSUE E
B 0.007 (0.180) M T L−M S N S
U 0.007 (0.180) M T L−M S N S
D
Z
D X G1 0.010 (0.250) S T L−M S N S
VIEW D−D
A 0.007 (0.180) M T L−M S N S
Z
R 0.007 (0.180) M T L−M S N S
H 0.007 (0.180) M T L−M S N S
CE
K1
0.004 (0.100)
G J −T− SEATING
PLANE
VIEW S
G1
K
F
VIEW S
0.007 (0.180) M T L−M S N S
0.010 (0.250) S T L−M S N S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
INCHES
DIM MIN MAX
A 0.385 0.395
B 0.385 0.395
C 0.165 0.180
E 0.090 0.110
F 0.013 0.019
G 0.050 BSC
H 0.026 0.032
J 0.020 −−−
K 0.025 −−−
R 0.350 0.356
U 0.350 0.356
V 0.042 0.048
W 0.042 0.048
X 0.042 0.056
Y −−− 0.020
Z 2 _ 10 _
G1 0.310 0.330
K1 0.040 −−−
MILLIMETERS
MIN MAX
9.78 10.03
9.78 10.03
4.20 4.57
2.29 2.79
0.33 0.48
1.27 BSC
0.66 0.81
0.51 −−−
0.64 −−−
8.89 9.04
8.89 9.04
1.07 1.21
1.07 1.21
1.07 1.42
−−− 0.50
2 _ 10 _
7.88 8.38
1.02 −−−
http://onsemi.com
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| PDF Descargar | [ Datasheet MC10H176.PDF ] | |
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