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PDF MC10H103 Data sheet ( Hoja de datos )

Número de pieza MC10H103
Descripción Quad 2-Input OR Gate
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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No Preview Available ! MC10H103 Hoja de datos, Descripción, Manual

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MC10H103
Quad 2−Input OR Gate
Description
The MC10H103 is a quad 2input OR gate. The MC10H103
provides one gate with OR/NOR outputs. This MECL 10Hpart is a
functional/pinout duplication of the standard MECL 10Kfamily
part, with 100% improvement in propagation delay, and no increases
in powersupply current.
Features
Propagation Delay, 1.0 ns Typical
Power Dissipation 25 mW/Gate (same as MECL 10K)
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K Compatible
PbFree Packages are Available*
http://onsemi.com
MARKING DIAGRAMS*
CDIP16
L SUFFIX
CASE 620A
16
MC10H103L
AWLYYWW
1
16
16
1
PDIP16
P SUFFIX
CASE 648
MC10H103P
AWLYYWWG
1
10H103
ALYWG
SOEIAJ16
CASE 966
1 20
20 1
PLLC20
FN SUFFIX
CASE 775
10H103G
AWLYYWW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = PbFree Package
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 Rev. 7
1
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Publication Order Number:
MC10H103/D

1 page




MC10H103 pdf
16
1
e
Z
D
b
0.13 (0.005) M
B
16
B
1
C
K
N
MC10H103
PACKAGE DIMENSIONS
SOEIAJ16
CASE 96601
ISSUE A
9
E HE
8
LE
M_
Q1
L
DETAIL P
VIEW P
A
c
A1
0.10 (0.004)
A
E
F
CDIP16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A01
ISSUE O
A
9
L
8
M
16X J
0.25 (0.010) M T B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A −−− 2.05 −−− 0.081
A1 0.05 0.20 0.002 0.008
b 0.35 0.50 0.014 0.020
c 0.10 0.20 0.007 0.011
D 9.90 10.50 0.390 0.413
E 5.10 5.45 0.201 0.215
e 1.27 BSC
0.050 BSC
HE 7.40 8.20 0.291 0.323
L 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M 0 _ 10 _ 0 _ 10 _
Q1 0.70 0.90 0.028 0.035
Z −−− 0.78 −−− 0.031
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C −−− 0.200 −−− 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC
1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC
2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC
7.62 BSC
M 0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
T
SEATING
PLANE
G
16X D
0.25 (0.010) M T A
http://onsemi.com
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