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PDF MBRB20100CT Data sheet ( Hoja de datos )

Número de pieza MBRB20100CT
Descripción SWITCHMODE Power Rectifier D2PAK Surface Mount Power Package
Fabricantes Motorola Semiconductors 
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MBRB20100CT/D
Designer's Data Sheet
SWITCHMODEPower Rectifier
D2PAK Surface Mount Power Package
The D2PAK Power Rectifier employs the use of the Schottky Barrier principle
with a platinum barrier metal. These state–of–the–art devices have the
following features:
Package Designed for Power Surface Mount Applications
Center–Tap Configuration
Guardring for Stress Protection
Low Forward Voltage
150°C Operating Junction Temperature
Epoxy Meets UL94, VO at 1/8
Guaranteed Reverse Avalanche
Short Heat Sink Tab Manufactured — Not Sheared!
Similar in Size to Industry Standard TO–220 Package
1
Mechanical Characteristics
Case: Epoxy, Molded
3
Weight: 1.7 grams (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal Leads are
Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Shipped 50 units per plastic tube
Available in 24 mm Tape and Reel, 800 units per 13reel by adding a “T4”
suffix to the part number
Marking: B20100T
MBRB20100CT
Motorola Preferred Device
SCHOTTKY BARRIER
RECTIFIER
20 AMPERES
100 VOLTS
4
41
3
CASE 418B–02
D2PAK
MAXIMUM RATINGS, PER LEG
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
100
Volts
Average Rectified Forward Current
(Rated VR) TC = 110°C
Total Device
IF(AV)
10 Amps
20
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz), TC = 100°C
IFRM
20 Amps
Non-repetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM
150 Amps
Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz)
Storage Temperature
Operating Junction Temperature
Voltage Rate of Change (Rated VR)
THERMAL CHARACTERISTICS, PER LEG
IRRM
Tstg
TJ
dv/dt
0.5
– 65 to +175
– 65 to +150
10000
Amp
°C
°C
V/µs
Thermal Resistance — Junction to Case
— Junction to Ambient (1)
(1) See Chapter 7 for mounting conditions
RθJC
RθJA
2.0 °C/W
50
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s and SWITCHMODE are trademarks of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Rev 1
©RMeoctotriofilea,rInDce. 1v9ic96e Data
1

1 page




MBRB20100CT pdf
PACKAGE DIMENSIONS
MBRB20100CT
C
E
BV
4
123
S
–T–
SEATING
PLANE
G
D 3 PL
0.13 (0.005) M T
A
K
J
H
CASE 418B–02
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.340 0.380
B 0.380 0.405
C 0.160 0.190
D 0.020 0.035
E 0.045 0.055
G 0.100 BSC
H 0.080 0.110
J 0.018 0.025
K 0.090 0.110
S 0.575 0.625
V 0.045 0.055
MILLIMETERS
MIN MAX
8.64 9.65
9.65 10.29
4.06 4.83
0.51 0.89
1.14 1.40
2.54 BSC
2.03 2.79
0.46 0.64
2.29 2.79
14.60 15.88
1.14 1.40
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
Rectifier Device Data
5

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