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PDF DS75S Data sheet ( Hoja de datos )
| Número de pieza | DS75S | |
| Descripción | 2.Wire Thermal Watchdog | |
| Fabricantes | Dallas Semiconducotr | |
| Logotipo |  |
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DS75
2–Wire Thermal Watchdog
www.dalsemi.com
FEATURES
=Temperature measurements require no
external components
Measures temperatures from –55°C to
+125°C. Fahrenheit equivalent is –67°F to
+257°F.
Thermometer accuracy is ±2.0°C.
Thermometer resolution is configurable from
nine (default) to 12 bits (0.5°C to 0.0625°C
resolution)
9–bit readout mode features a max
conversion time of 150 ms.
Thermostatic settings are user definable.
Data is read from/written via a 2–wire serial
interface. (open drain I/O lines). 3–bit
addressability
Wide power supply range (2.7V – 5.5V).
Applications include personal computers,
cellular telephones, office equipment, or any
thermally sensitive system.
Pin/software compatible to LM75CIM–x
Thermal Watchdog in 9–bit (default) mode.
8–pin 150 mil SOIC package.
PIN ASSIGNMENT
SDA
1
8 VDD
SCL 2
7 A0
O.S. 3
6 A1
GND
4
5 A2
DS75S
8-PIN SOIC (150 MIL)
PIN DESCRIPTION
SDA – 2–Wire Serial Data Input/Output
SCL – 2–Wire Serial Clock
GND – Ground
O.S. – Thermostat Output Signal
A0 – Chip Address Input
A1 – Chip Address Input
A2 – Chip Address Input
V DD – Power Supply Voltage
DESCRIPTION
The DS75 2–wire thermal watchdog provides 9–bit temperature readings which indicate the temperature
of the device. Thermostat settings and temperature readings are all communicated to/from the DS75 over
a simple 2–wire serial interface. No additional components are required; the device is truly a
“temperature–to–digital” converter.
The DS75 has three address bits that allow a user to multidrop up to eight sensors along the 2–wire bus,
greatly simplifying the bussing of distributed temperature sensing networks.
The open–drain thermal alarm output, O.S., becomes active when the temperature of the device exceeds a
user–defined temperature TOS. The number of consecutive faults required to set O.S. active is
configurable by the user. The device can also be configured in the interrupt or comparator mode, to
customize the method which clears the fault condition.
For applications that require greater temperature resolution, the user can adjust the readout resolution
from 9 to 12 bits. This is particularly useful in applications where thermal runaway conditions must be
detected quickly.
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1 page  
O.S. OUTPUT TRANSFER FUNCTION Figure 2
DS75
Regardless of the mode chosen, the O.S. output is open–drain and the active state is set in the configura-
tion register. The power–up default is active low. Refer to the “OPERATION–Programming” section for
instructions in adjusting the thermostat setpoints, thermostat mode, and O.S. active state.
OPERATION–Programming
There are three areas of interest in programming the DS75: Configuration register, TOS register, and the
THYST register. All programming is done via the 2–wire interface by setting the pointer to the appropriate
location. Table 3 illustrates the pointer settings for the four registers of the DS75.
Pointer Register Structure Table 3
POINTER ACTIVE REGISTER
00h Temperature (default)
01h Configuration
02h THYST
03h TOS
The DS75 will power up with the temperature register selected. If the host wishes to change the data
pointer, it simply addresses the DS75 in the write mode (R/W=0), receives an acknowledge, and writes
the 8 bits that correspond to the new desired location. The last pointer location is always maintained so
that consecutive reads from the same register do not require the host to always provide a pointer address.
The only exception is at power–up, in which case the pointer will always be set to 00h, the temperature
register. The pointer address must always proceed data in writing to a register, regardless of which
address is currently selected. Please refer to the “2–Wire Serial Data Bus” section for details of the 2–
wire bus protocol.
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ABSOLUTE MAXIMUM RATINGS*
Voltage on VDD, Relative to Ground
Voltage on any other pin, Relative to Ground
Operating Temperature
Storage Temperature
Soldering Temperature
–0.3V to +7.0V
–0.3V to (V DD + 0.3V)
–55°C to +125°C
–55°C to +125°C
260°C for 10 seconds
DS75
* This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operation sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods of time may affect reliability.
The Dallas Semiconductor DS75 is built to the highest quality standards and manufactured for long term
reliability. All Dallas Semiconductor devices are made using the same quality materials and
manufacturing methods. However, the DS75 is not exposed to environmental stresses, such as burn–in,
that some industrial applications require. For specific reliability information on this product, please
contact the factory in Dallas at (972) 371–4448.
RECOMMENDED DC OPERATING CONDITIONS
(-55°C to +125°C; 2.7V ≤ VDD ≤ 5.5V)
PARAMETER
SYMBOL CONDITION MIN TYP
Supply Voltage
VDD
2.7
MAX
5.5
UNITS NOTES
V
DC ELECTRICAL CHARACTERISTICS (-55°C to +125°C; 2.7V ≤ VDD ≤ 5.5V)
PARAMETER
SYMBOL CONDITION MIN TYP MAX UNITS NOTES
Input Logic High
VIH
0.7VDD
VDD+0.5
V
1
Input Logic Low
VIL
-0.5
0.3VDD
V
1
SDA Output Logic Low
Voltage
VOL1
3 mA sink
current
0
0.4 V
1
VOL2
6 mA sink
current
0
0.6
O.S. Saturation Voltage
VOL
4 mA sink
current
0.8 V 1, 9
Input current each I/O pin
0.4 < VI/O<
0.9 VDD
-10
+10 µA
2
I/O Capacitance
CI/O
10 pF
Standby Current
IDD1
1 µA 3, 4
Active Current
Active Temp.
IDD
Conversions
Communica-
tion only
1000
µA 3, 4
100
11 of 13
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| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet DS75S.PDF ] | |
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