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PDF CXD1172 Data sheet ( Hoja de datos )
| Número de pieza | CXD1172 | |
| Descripción | 6-bit 20MSPS Video A/D Converter (CMOS) | |
| Fabricantes | Sony Corporation | |
| Logotipo |  |
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CXD1172AM/AP
6-bit 20MSPS Video A/D Converter (CMOS)
Description
CXD1172AM/AP is a 6-bit CMOS A/D converter for
video use. The adoption of a 2-step parallel system
achieves low consumption at a maximum conversion
speed of 20MSPS minimum, 35MSPS typical.
CXD1172AM
16 pin SOP (Plastic)
CXD1172AP
16 pin DIP (Plastic)
Features
• Resolution: 6-bit ± 1/2LSB
• Max. sampling frequency: 20MSPS
• Low power consumption: 40mW (at 20MSPS typ.)
(Reference current excluded)
• Built-in sampling and hold circuit.
• 3-state TTL compatible output.
• Power supply: 5V single
• Low input capacitance: 4pF
• Reference impedance: 250Ω (typ.)
Applications
TV, VCR digital systems and a wide range of fields
where high speed A/D conversion is required.
Structure
Silicon gate CMOS monolithic IC
Absolute Maximum Ratings (Ta = 25°C)
• Supply voltage VDD
7V
• Reference voltage
VRT, VRB VDD + 0.5 to VSS – 0.5 V
• Input voltage VIN
VDD + 0.5 to VSS – 0.5 V
(Analog)
• Input voltage VCLK VDD + 0.5 to VSS – 0.5 V
(Digital)
• Output voltage VOH, VOL VDD + 0.5 to VSS – 0.5 V
(Digital)
• Storage temperature
Tstg –55 to +150 °C
Recommended Operating Conditions
• Supply voltage AVDD, AVSS 4.75 to 5.25 V
DVDD, DVSS 4.75 to 5.25
V
• Reference input voltage
VRB
0 to 4.1
V
VRT
0.9 to 5.0
V
VRT – VRB
0.9 to AVDD
V
• Analog input voltage
VIN
VRB to VRT
V
• Clock pulse width
TPW1, TPW0 23ns (min.) to 1.1µs (max.)
• Operating temperature
Topr
–20 to +75 °C
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E89320C78-PS
1 page  
CXD1172AM/AP
Electrical Characteristics Test Circuit
}Integral non-linearity error
Differential non-linearity
Test Circuit
Offset voltage
+V
S2
S1 : ON IF A < B
S2 : ON IF B > A
S1
–V
A<B A>B
VIN CXD1172A 6
COMPARATOR
A6 B6
to to
A1 B1
6
BUFFER
“0” A0
B0 “1”
DVM
CLK (20MHz)
000 … 00
6 to
111 … 0
CONTROLLER
}Maximum operational speed
Differential gain error
Test Circuit
Differential phase error
2.0V
FC – 1kHz
CX20202A-1
S. G.
NTSC
SIGNAL
SOURCE
1.0V
1
AMP
2
VIN CXD
1172A
100 40 IRE
MODULATION
2.0V
BURST
6
TTL 6
ECL 620
10bit
D/A
CLK
–5.2V
1
2
0
–40 SYNC
1.0V
620
S. G.
(CW) FC
TTL
–5.2V
ECL
H. P. F
VECTOR
SCOPE
D. G
D. P
ERROR RATE
COUNTER
Digital output current test circuit
2.0V
1.0V
VCC
VRT
VIN
VRB
CLK
GND
IOL
VOL +
–
2.0V
1.0V
VCC
VRT
VIN
VRB
CLK
GND
IOH
VOH
+
–
–5–
5 Page 
Package Outline
Unit: mm
CXD1172AM
16PIN SOP (PLASTIC) 300mil
+ 0.4
9.9 – 0.1
16
9
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
8
1.27
+ 0.1
0.2 – 0.05
± 0.12 M
SONY CODE
EIAJ CODE
SOP-16P-L01
∗SOP016-P-0300-A
JEDEC CODE
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.2g
CXD1172AP
16PIN DIP (PLASTIC)
+ 0.4
19.2 – 0.1
16 9
18
2.54
0° to 15°
CXD1172AM/AP
0.5 ± 0.1
1.2 ± 0.15
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-16P-01
DIP016-P-0300
Similar to MO-001-AE
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
COPPER ALLOY
1.0 g
– 11 –
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet CXD1172.PDF ] | |
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