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PDF MMBD6050LT1G Data sheet ( Hoja de datos )
| Número de pieza | MMBD6050LT1G | |
| Descripción | Switching Diode | |
| Fabricantes | ON Semiconductor | |
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MMBD6050LT1G
Switching Diode
Features
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
THERMAL CHARACTERISTICS
Symbol
VR
IF
IFM(surge)
Value
70
200
500
Unit
Vdc
mAdc
mAdc
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) TA = 25°C
Derate above 25°C
Symbol
PD
Max Unit
225 mW
1.8 mW/°C
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation Alumina
Substrate, (Note 2) TA = 25°C
Derate above 25°C
RqJA
PD
556 °C/W
300 mW
2.4 mW/°C
Thermal Resistance, Junction−to−Ambient RqJA
417 °C/W
Junction and Storage Temperature
TJ, Tstg −55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Rating
Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 mAdc)
VR
70 −
Vdc
Reverse Voltage Leakage Current
(VR = 50 Vdc)
IR − 0.1 mAdc
Forward Voltage
(IF = 1.0 mAdc)
(IF = 100 mAdc)
VF Vdc
0.55 0.7
0.85 1.1
Reverse Recovery Time (Figure 1)
(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc)
tRR
− 4.0 ns
Capacitance
(VR = 0 V)
CD − 2.5 pF
Product parametric performance is indicated in the Electrical Characteristics for
the listed test conditions, unless otherwise noted. Product performance may not
be indicated by the Electrical Characteristics if operated under different
conditions.
www.onsemi.com
3
CATHODE
1
ANODE
3
1
2
SOT−23 (TO−236)
CASE 318
STYLE 8
MARKING DIAGRAM
5A M G
G
1
5A = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
MMBD6050LT1G SOT−23 3,000 / Tape & Reel
(Pb−Free)
MMBD6050LT3G SOT−23 10,000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 1994
October, 2016 − Rev. 7
1
Publication Order Number:
MMBD6050LT1/D
1 page | ||
| Páginas | Total 3 Páginas | |
| PDF Descargar | [ Datasheet MMBD6050LT1G.PDF ] | |
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