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PDF AMIS-30523 Data sheet ( Hoja de datos )
| Número de pieza | AMIS-30523 | |
| Descripción | CAN Micro-Stepping Motor Driver | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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AMIS-30523
Product Preview
CAN Micro-Stepping Motor
Driver
Introduction
The AMIS−30523 is a micro−stepping stepper motor driver for
bipolar stepper motors with an embedded CAN transceiver.
The motor driver is connected through I/O pins and a SPI interface
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with an external microcontroller. It has an on−chip voltage regulator,
reset−output and watchdog reset, able to supply peripheral devices. It
contains a current−translation table and takes the next micro−step
depending on the clock signal on the “NXT” input pin and the status of
the “DIR” (=direction) register or input pin.
The CAN transceiver is the interface between a (CAN) protocol
controller and the physical bus. It provides differential transmit
1 52
capability to the bus and differential receive capability to the CAN
controller. To cope with the long bus delay the communication speed
QFN52, 8x8
CASE 485M
needs to be low. The integrated transceiver allows low transmit data
rates down 10 kbit/s or lower.
The AMIS−30523 is ideally suited for general−purpose stepper
motor applications in the automotive, industrial, medical, and marine
environment. With the on−chip voltage regulator and embedded CAN
transceiver it further reduces the BOM for mechatronic stepper
applications.
Key Features
Motor Driver
MARKING DIAGRAM
1
AMIS30523
0C523−001
XXXXYZZ
• Dual H−Bridge for 2−Phase Stepper Motors
• Programmable Peak−Current up to 1.2 A Continuous (1.6 A for a
Short Time)*
• On−Chip Current Translator
• SPI Interface
0C523−001 = Specific Device Code
XXXX
= Date Code
WL = Wafer Lot
Y = Assembly Location
ZZ = Traceability Code
• Seven Step Modes from Full Step up to 32 Micro−Steps
• PWM Current Control with Automatic Selection of Fast and Slow
Decay and Fully Integrated Current−Sense
• Full Output Protection and Diagnosis
• Thermal Warning and Shutdown
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 34 of this data sheet.
• Integrated 5 V Regulator to Supply External
• Low EME: Common−Mode Choke is No Longer
Microcontroller
Required
CAN Transceiver
• Compatible with the ISO 11898 Standard
• Wide Range of Bus Communication Speed (0 up to 1
Mbit/s)
• Allows Low Transmit Data Rate in Networks
Exceeding 1 km
• Extremely Low Current Standby Mode with Wake−up
via the Bus
• Differential Receiver with Wide common−mode range
($35 V)
• Voltage Source via VSPLIT Pin for Stabilizing the
Recessive Bus Level
• No Disturbance of the Bus Lines with an Un−Powered
Node
• Logic Level Inputs Compatible with 3.3 V Devices
• These are Pb−Free Devices
*Output Current Level May be Limited by Ambient Temperature and Heat Sinking
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2010
November, 2010 − Rev. P0
1
Publication Order Number:
AMIS−30523/D
1 page  
AMIS−30523
Table 3. THERMAL RESISTANCE
Package
QFN−52
Junction−to−Exposed Pad
(RthJ−EP)
0.95
Thermal Resistance
Junction−to−Ambient (RthJ−A)
1S0P Board
2S2P Board
60 30
Unit
K/W
EQUIVALENT SCHEMATICS
Following figure gives the equivalent schematics of the user relevant inputs and outputs. The diagrams are simplified
representations of the circuits used.
4k
IN
Rpd
OUT
TYPE 1: CLR Input
4k
IN
TYPE 4: DO and ERR Open
Drain Outputs
Rout
SLA
TYPE 2: CLK, DI, CS, NXT, DIR Inputs
VDD
VDD
VBB
VBB
TYPE 5: SLA Analog Output
TYPE 3: VDD and VBB Power Supply
Figure 3. In− and Output Equivalent Diagrams
PACKAGE THERMAL CHARACTERISTICS
The AMIS−30523 is available in a QFN−52 package. For
cooling optimizations, the QFN has an exposed thermal pad
which has to be soldered to the PCB ground plane. The
ground plane needs thermal vias to conduct the heat to the
bottom layer. Figure 4 gives an example for good power
distribution solutions.
For precise thermal cooling calculations the major
thermal resistances of the device are given. The thermal
media to which the power of the devices has to be given are:
• Static environmental air (via the case)
• PCB board copper area (via the exposed pad)
The thermal resistances are presented in Table 5: DC
Parameters Motor Driver.
The major thermal resistances of the device are the Rth
from the junction to the ambient (RthJ−A) and the overall Rth
from the junction to exposed pad (RthJ−EP). In Table 3 one
can find the values for the RthJ−A and RthJ−EP, simulated
according to JESD−51:
The RthJ−A for 2S2P is simulated conform JEDEC
JESD−51 as follows:
• A 4−layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
• Board thickness is 1.46 mm (FR4 PCB material)
• The 2 signal layers: 70 mm thick copper with an area of
5500 mm2 copper and 20% conductivity
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5
5 Page 
AMIS−30523
Table 8. DC PARAMETERS CAN TRANSCEIVER
(The DC parameters are given for VCC and temperature in its operating range; TJ = −40 to +150°C; RLT = 60 W unless otherwise
specified) Convention: currents flowing in the circuit are defined as positive.
Symbol Pin(s)
Parameter
Remark /
Test Conditions
Min Typ Max
SUPPLY
ICC VCC Supply current
ICCS
Supply current in standby mode
TRANSMITTER DATA INPUT
DRoemceinssainvte; ;VVTTxxDD==0VVCC
TJ,max = 100°C
45 65
48
ViH High−level input voltage
CAN bus output
recessive
2.0 − VCC +
0.3
ViL Low−level input voltage
TXD
IiH High−level input current
IiL Low−level input current
Ci Input capacitance
TRANSMITTER MODE SELECT
CAN bus output
dominant
VTxD = VCC
VTxD = 0 V
(Note 15)
−0.3 − +0.8
−5 0 +5
−75 −200 −350
− 5 10
ViH High−level input voltage
Standby mode
2.0 − VCC +
0.3
ViL Low−level input voltage
IiH TXD High−level input current
IiL Low−level input current
Ci Input capacitance
RECEIVER DATA OUTPUT
Normal mode
VSTB = VCC
VSTB = 0 V
(Note 15)
−0.3 − +0.8
−5 0 +5
−1 −4 −10
− 5 10
VOH High−level output voltage
VOL Low−level output voltage
Ioh RXD High−level output current
Iol Low−level output current
Ci Input capacitance
15. Characterization Data Only, not tested in production.
IRXD = −10 mA
IRXD = 5 mA
Vo = 0.7 x VCC
Vo = 0.3 x VCC
(Note 15)
0.6 x
VCC
−5
5
−
0.25
−10
10
5
0.75 x
VCC
0.45
−15
15
10
Unit
mA
mA
V
V
mA
mA
pF
V
V
mA
mA
pF
V
V
mA
mA
pF
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11
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| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet AMIS-30523.PDF ] | |
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