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PDF HMC986 Data sheet ( Hoja de datos )
| Número de pieza | HMC986 | |
| Descripción | GaAs MMIC REFLECTIVE SPDT SWITCH | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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v01.0212
Typical Applications
The HMC986 is ideal for:
• Wideband Switching Matrices
• High Speed Data Infrastructure
• Military Comms, RADAR, and ECM
• Test and Measurement Equipment
• Jamming and EW Subsystems
Functional Diagram
HMC986
GaAs MMIC REFLECTIVE
SPDT SWITCH, 0.1 - 50 GHz
Features
Wideband Performance: 0.1 to 50 GHz
Low Insertion Loss: 1.9 dB at 40 GHz
High Isolation: 31 dB at 40 GHz
Fast Switching Speed: 10 ns
Compact Die Size: 0.98 x 0.75 x 0.1 mm
General Description
The HMC986 is a wideband GaAs pHEMT MMIC
Single Pole Double Throw (SPDT) switch die. This tiny
switch employs a reflective topology and is controlled
with two complementary inputs of 0/-3V to 0/-5V. With
an input signal at 40 GHz, the HMC986 exhibits 20 dB
return loss, 31 dB isolation, and only 1.9 dB insertion
loss. The combination of wideband performance and
fast switching speed make this switch ideal for test
equipment, switching matrices, and electronic warfare
(EW) applications. RF performance is independent of
high level control voltages, and is shown at both -3V
and -5V for completeness.
Electrical Specifications, TA = +25° C, With 0/-3V to -5V Control, 50 Ohm System
Parameter
Frequency
Min. Typ. Max.
Insertion Loss
0.1 - 18 GHz
18 - 40 GHz
40 - 50 GHz
1.7 2.3
1.9 2.5
2.2 2.8
Isolation
0.1 - 18 GHz
18 - 40 GHz
40 - 50 GHz
30 36
25 32
22 28
Return Loss
“On State”
0.1 - 50 GHz
20
Input Power for 0.1 dB Compression
0.1 - 2 GHz
2 - 50 GHz
5
21
Input Power for 1.0 dB Compression
0.1 - 2 GHz
2 - 50 GHz
10
22 25
Input Third Order Intercept
(Two-Tone Input Power = 0 dBm Each Tone, 1 MHz Tone Separation)
0.1 - 2 GHz
2 - 50 GHz
20
40
Switching Characteristics
tRISE, tFALL (10/90% RF)
tON, tOFF (50% CTL to 10/90% RF)
0.1 - 50 GHz
1
10
Units
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
dBm
dBm
dBm
ns
ns
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1 page  
Outline Drawing
v01.0212
HMC986
GaAs MMIC REFLECTIVE
SPDT SWITCH, 0.1 - 50 GHz
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. BACKSIDE METALIZATION: GOLD
4. BACKSIDE METAL IS GROUND
5. BOND PAD METALIZATION: GOLD
6. OVERALL DIE SIZE ±.002”
Die Packaging Information [1]
Standard
Alternate
WP-13 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section of the
Hittite website for die packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Die Pad Dimensions
Pad Number
2, 5, 8
1, 3, 4, 6, 7, 9, 10, 11, 12, 13
Size
.004” x .004”
.003” x .003”
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5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HMC986.PDF ] | |
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