|
|
Número de pieza | HMC633 | |
Descripción | GaAs PHEMT MMIC DRIVER AMPLIFIER | |
Fabricantes | Analog Devices | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de HMC633 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
No Preview Available ! v00.1107
Typical Applications
2 The HMC633 is ideal for:
• Point-to-Point Radios
• Point-to-Multi-Point Radios & VSAT
• LO Driver for Mixers
• Military & Space
Functional Diagram
HMC633
GaAs PHEMT MMIC DRIVER
AMPLIFIER, 5 - 17 GHz
Features
Gain: 29 dB
P1dB: +23 dBm
Output IP3: +30 dBm
Saturated Power: +24 dBm @ 27% PAE
Supply Voltage: +5V @ 180 mA
50 Ohm Matched Input/Output
Die Size: 2.07 x 0.93 x 0.1 mm
General Description
The HMC633 is a GaAs MMIC PHEMT Driver
Amplifier die which operates between 5 and 17 GHz.
The amplifier provides up to 31 dB of gain, +30 dBm
Output IP3, and +23 dBm of output power at 1 dB
gain compression, while requiring 180 mA from a +5V
supply. The HMC633 is an ideal driver amplifier for
microwave radio applications from 5 to 17 GHz, and
may also be biased at +5V, 130 mA to provide 2 dB
lower gain with improved PAE. The HMC633 amplifier
I/O’s are DC blocked and internally matched to 50
Ohms facilitating easy integration into Multi-Chip-
Modules (MCMs). All data is taken with die connected
at input and output RF ports via one 1 mil wedge bond
with minimal length of 0.31 mm (12 mils).
Electrical Specifications, TA = +25° C, Vdd1, Vdd2, Vdd3, Vdd4 = 5V, Idd = 180 mA[1]
Parameter
Frequency Range
Gain
Gain Variation Over Temperature
Input Return Loss
Output Return Loss
Output Power for 1 dB Compression (P1dB)
Saturated Output Power (Psat)
Output Third Order Intercept (IP3)
Noise Figure
Supply Current (Idd= Idd1 + Idd2 + Idd3 + Idd4)
[1] Adjust Vgg between -2 to 0V to achieve Idd = 180mA Typical
Min.
27
21
Typ.
5-9
31
0.035
14
15
23
24
30
9
180
Max.
0.044
Min.
26
21
Typ.
9 - 17
29
0.040
16
12
23
23.5
30
7
180
Max.
0.050
Units
GHz
dB
dB/ °C
dB
dB
dBm
dBm
dBm
dB
mA
2-1
IrnefsopFromonastriibopinlitryfuiicrsneaissh,seuddmeebdylibvAyenAarlnoyagloaDgneDvdeicveitcsoesispfoblreaitliscevueesdeo, tnorodrbfeeorraascn:cyuHirnafirteitntgaietnemderMnetlsiaiocbflrepo.atHweonawtsevovereor,tChneoor
rliicgehntsseofisthgirrdanptaerdtiebsythimatpmlicaPaythiorenosuonlrteofr:tohme9rwi7tsi8sue-seu2.n5dSep0re-ca3infiyc3ap4tiaot3nesntsourbjFpeacattetxnot:crhi9gah7ntgs8eo-wf2Ait5hnoa0ulot-gn3oD3tiec7vei.c3eNso.
Trademarks and registered trademarks aArepthpe plircopaerttiyoonf thSeirurepsppeoctirvte:oPwnheros.ne: 978-250-
rpOFOPoohnrrrodeanpetTeireroi:cc7nOeh8,,nn1o2d--3le0lo2ilgni9vAyee-4lrWpya7,ah0tya0aw,n•PdRw.OOtowor.daB.epdhorla,ixotcCtn9eil1tihen0oee.6rcdl,ameoNtrmwoss:rfwwoAworndo.aad,lno,MagMloAADge.0c0v2o1ic0m8e62s2,-49In10c.6,
3 3A4p3plicoartioan pSpupsp@ohrt:itPtihtoen.ce:o1m-800 -ANALOG-D
1 page v00.1107
Outline Drawing
2
HMC633
GaAs PHEMT MMIC DRIVER
AMPLIFIER, 5 - 17 GHz
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
2-5
IrnefsopFromonastriibopinlitryfuiicrsneaissh,seuddmeebdylibvAyenAarlnoyagloaDgneDvdeicveitcsoesispfoblreaitliscevueesdeo, tnorodrbfeeorraascn:cyuHirnafirteitntgaietnemderMnetlsiaiocbflrepo.atHweonawtsevovereor,tChneoor
rliicgehntsseofisthgirrdanptaerdtiebsythimatpmlicaPaythiorenosuonlrteofr:tohme9rwi7tsi8sue-seu2.n5dSep0re-ca3infiyc3ap4tiaot3nesntsourbjFpeacattetxnot:crhi9gah7ntgs8eo-wf2Ait5hnoa0ulot-gn3oD3tiec7vei.c3eNso.
Trademarks and registered trademarks aArepthpe plircopaerttiyoonf thSeirurepsppeoctirvte:oPwnheros.ne: 978-250-
rpOFOPoohnrrrodeanpetTeireroi:cc7nOeh8,,nn1o2d--3le0lo2ilgni9vAyee-4lrWpya7,ah0tya0aw,n•PdRw.OOtowor.daB.epdhorla,ixotcCtn9eil1tihen0oee.6rcdl,ameoNtrmwoss:rfwwoAworndo.aad,lno,MagMloAADge.0c0v2o1ic0m8e62s2,-49In10c.6,
3 3A4p3plicoartioan pSpupsp@ohrt:itPtihtoen.ce:o1m-800 -ANALOG-D
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet HMC633.PDF ] |
Número de pieza | Descripción | Fabricantes |
HMC6300 | 60 GHz Millimeterwave Transmitter | Analog Devices |
HMC6301 | Millimeterwave Receiver | Analog Devices |
HMC630LP3 | GaAs HBT VECTOR MODULATOR | Analog Devices |
HMC630LP3E | GaAs HBT VECTOR MODULATOR | Analog Devices |
Número de pieza | Descripción | Fabricantes |
SLA6805M | High Voltage 3 phase Motor Driver IC. |
Sanken |
SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
Analog Devices |
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |