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PDF SN54LS07 Data sheet ( Hoja de datos )

Número de pieza SN54LS07
Descripción Hex Buffers and Drivers
Fabricantes Texas 
Logotipo Texas Logotipo



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No Preview Available ! SN54LS07 Hoja de datos, Descripción, Manual

The SN54LS07 and SN74LS17 are
obsolete and are no longer supplied.
SN54LS07, SN74LS07, SN74LS17
HEX BUFFERS/DRIVERS
WITH OPENĆCOLLECTOR HIGHĆVOLTAGE OUTPUTS
SDLS021C − MAY 1990 − REVISED FEBRUARY 2004
D Convert TTL Voltage Levels to MOS Levels
D High Sink-Current Capability
D Input Clamping Diodes Simplify System
SN54LS07 . . . J PACKAGE
SN74LS07, SN74LS17 . . . D, DB, N, OR NS PACKAGE
(TOP VIEW)
Design
D Open-Collector Driver for Indicator Lamps
and Relays
1A 1
1Y 2
2A 3
2Y 4
14 VCC
13 6A
12 6Y
11 5A
description/ordering information
These hex buffers/drivers feature high-voltage
open-collector outputs to interface with high-level
3A 5
3Y 6
GND 7
10 5Y
9 4A
8 4Y
circuits or for driving high-current loads. They are
also characterized for use as buffers for driving TTL inputs. The ’LS07 devices have a rated output voltage of
30 V, and the SN74LS17 has a rated output voltage of 15 V. The maximum sink current is 30 mA for the
SN54LS07 and 40 mA for the SN74LS07 and SN74LS17.
These circuits are compatible with most TTL families. Inputs are diode-clamped to minimize transmission-line
effects, which simplifies design. Typical power dissipation is 140 mW, and average propagation delay time is
12 ns.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP − N
Tube
SN74LS07N
SN74LS07N
0°C to 70°C
SOIC − D
SOP − NS
Tube
Tape and reel
Tape and reel
SN74LS07D
SN74LS07DR
SN74LS07NSR
LS07
74LS07
SSOP − DB Tape and reel SN74LS07DBR LS07
Package drawings, standard packing quantities, thermal data, symbolization, and PCB
design guidelines are available at www.ti.com/sc/package.
logic diagram (positive logic)
1
1A
2
1Y
3
2A
4
2Y
3A 5
6
3Y
9
4A
8
4Y
5A 11
10
5Y
13
6A
12
6Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 2004, Texas Instruments Incorporated
On products compliant to MILĆPRFĆ38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1

1 page




SN54LS07 pdf
www.ti.com
PACKAGE OPTION ADDENDUM
24-Apr-2006
PACKAGING INFORMATION
Orderable Device
SN74LS07D
SN74LS07DBLE
SN74LS07DBR
SN74LS07DBRE4
SN74LS07DBRG4
SN74LS07DE4
SN74LS07DR
SN74LS07DRE4
SN74LS07N
SN74LS07NE4
SN74LS07NSR
SN74LS07NSRE4
SN74LS07NSRG4
SN74LS17D
SN74LS17N
Status (1)
ACTIVE
Package
Type
SOIC
Package
Drawing
D
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
ACTIVE
SSOP
DB
ACTIVE
SSOP
DB
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
PDIP
N
ACTIVE
PDIP
N
ACTIVE
SO
NS
ACTIVE
SO
NS
ACTIVE
SO
NS
OBSOLETE
OBSOLETE
SOIC
PDIP
D
N
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14
TBD
Call TI
Call TI
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14
TBD
Call TI
Call TI
14
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
Addendum-Page 1

5 Page





SN54LS07 arduino
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Amplifiers
amplifier.ti.com
Data Converters
dataconverter.ti.com
DSP
dsp.ti.com
Interface
interface.ti.com
Logic
logic.ti.com
Power Mgmt
power.ti.com
Microcontrollers
microcontroller.ti.com
Low Power Wireless www.ti.com/lpw
Applications
Audio
Automotive
Broadband
Digital Control
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
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Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated

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