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Número de pieza U0805RxxxxxT
Descripción Multilayer Ceramic Capacitors
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U0805RxxxxxT datasheet

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U0805RxxxxxT pdf
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Nickel Barrier
Multilayer Ceramic Capacitors
Item
Performance
Test or Inspection Method
Temperature
Characteristic
of Capacitance
Temperatures Coefficient
TC
Operating
Temperature
NPO -55 ~ +125°C
X7R -55 ~ +125°C
X5R -55 ~ +85°C
Y5V -55 ~ +125°C
Z5U -55 ~ +125°C
Capacitance
Change (DC)
0 ±30 (ppm/°C)
±15%
±15%
+22% ~ -82%
+22% ~ -56%
The temperature coefficient is determined using the
capacitance measured in step 3 as a reference. Test the
specimen from step 1through step 5, the capacitance shall
be within the specified tolerance for the capacitance
coefficient and capacitance change as left table.
Code
1
2
3
Temperature Coefficient
Base Temperature (25°C) ±2°C
Minimum Operation Temperature ±2°C
Base Temperature (25°C) ±2°C
4 Minimum Operation Temperature ±2°C
5 Base Temperature (25°C) ±2°C
Solderabiliy
New solder to over 95% of termination
Leaching
External
Appearance
No mechanical Damage
Completely soak both terminal electrodes in
solder at specified temperature for 3 ±0.5 second
a. For Tin-Lead Sn/Pb) Termination product:
235 ±5°C.
b. For Lead-free (Pure Sn) Termination
product: 245 ±5°C.
Completely soak both terminal electrodes in solder at 270
±5°C for 40 ±1second.
NPO
Capacitance
Change
(C/C)
X7R/X5
R
Z5U
Y5V
±2.5% or ±0.25 pF maximum
(Whichever is larger)
±7.5%
±20%
±20%
Soldering
to heat
NPO: C 30pF : Q 1000
C<30pF:Q 400 + 20°C
PS: C : Nominal Capacitance (pF)
X7R, X5R, Y5V, Z5U : (Maximum Value)
DF
T.C.
50V
25V
16V 10V
X7R/
X5R
2.5% 3.0% 3.5% 5.0%
Z5U 4.0% - - -
Y5V 5.0% 7.5% 9.0% 12.5%
Completely immerse both
terminations in solder at 270 ±5°C for 10 ±3 second.
Leave the capacitors in ambient condition for 2 4 ±2 hours
before measurement.
*Preconditioning: F(only for Class 2):
Perform a heat treatment at 150 +0-10°C for one hour and
then let sit for 24 ±2 hours at room temperature.
Perform the initial measurement.
NPO:
100,000MW minimum or R x C 1000W
IR
x F (Whichever is smaller)
X7R, X5R, Y5V, Z5U:
10,000MW minimum or R x C 1000W
x F (Whichever is smaller)
Page 5
27/04/06 V1.0

5 Page

U0805RxxxxxT arduino
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Nickel Barrier
Multilayer Ceramic Capacitors
Precautions for Assembly
Adhesives for Mounting
(1) Selection of adhesives
a. The viscosity of an adhesive for mountings shall be such that the adhesive dose not flow off on the land during its curing.
b. If the adhesive is too low in its viscosity, mounted components may be out of alignment after or during soldering.
c. The adhesives shall not be corrosive or chemically active to the mounted components and the PC boards.
d. The amount of adhesive shall be such that the adhesive does not flow off or be out of alignment.
e. Adhesives for mountings can be cured by ultraviolet or infrared radiation. In order to prevent the terminal electrodes of the
Capacitors the curing shall be done at conditions of 180°C maximum, for 2 minutes maximum.
Chip Mounting consideration
In mounting the Capacitors / components on a printed circuit board, any bending and expanding force against them shall be kept
minimum to prevent them from being damaged or cracked.
Following precautions and recommendation shall be observed carefully in the process:
(1) Maximum stroke of the vacuum nozzle shall be adjusted so that the pushing force to the printed circuit board shall be limited to a
static of 1 to 3 N (100 to 300 gf) (See Figure4).
(2) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of printed circuit board dose not exceeded 0.5mm
(See Figure 4)
Figure 4
(3) The printed circuit board shall be supported by means of adequate supporting pins as shown in Fig.5-(b)
Figure 5
Page 11
27/04/06 V1.0

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