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PDF V048F040M050 Datasheet ( Hoja de datos )

Número de pieza V048F040M050
Descripción (V048F040x050) Voltage Transformation Module
Fabricantes Vicor Corporation 
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V048F040M050 datasheet

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V048F040M050 pdf
Pin/Control Functions
PRELIMINARY
+IN/-IN DC Voltage Ports
The VTM input should not exceed the maximum specified. Be aware of
this limit in applications where the VTM is being driven above its
nominal output voltage. If less than 26 Vdc is present at the +In and -In
ports, a continuous VC voltage must be applied for the VTM to process
power. Otherwise VC voltage need only be applied for 10 ms after the
voltage at the +In and -In ports has reached or exceeded 26 Vdc. If the
input voltage exceeds the overvoltage turn-off, the VTM will shutdown.
The VTM does not have internal input reverse polarity protection.
Adding a properly sized diode in series with the positive input or a
fused reverse-shunt diode will provide reverse polarity protection.
TM – For Factory Use Only
VC – VTM Control
The VC port is multiplexed. It receives the initial VCC voltage from an
upstream PRM, synchronizing the output rise of the VTM with the
output rise of the PRM. Additionally, the VC port provides feedback to
the PRM to compensate for the VTM output resistance. In typical
applications using VTMs powered from PRMs, the PRM’s VC port
should be connected to the VTM VC port.
In applications where a VTM is being used without a PRM, 14 V must
be supplied to the VC port for as long as the input voltage is below 26 V
and for 10 ms after the input voltage has reached or exceeded 26 V. The
VTM is not designed for extended operation below 26 V. The VC port
should only be used to provide VCC voltage to the VTM during startup.
+Out
-Out
+Out
-Out
43
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
21
A
B
C
D
E
+In
TM
H
J VC
K
PC
L
M
N
P -In
R
T
Bottom View
Signal Name
+In
–In
TM
VC
PC
+Out
–Out
Pin Designation
A1-E1, A2-E2
L1-T1, L2-T2
H1, H2
J1, J2
K1, K2
A3-D3, A4-D4,
J3-M3, J4-M4
E3-H3, E4-H4,
N3-T3, N4-T4
PC – Primary Control
The Primary Control (PC) port is a multifunction port for controlling the
VTM as follows:
Disable – If PC is left floating, the VTM output is enabled. To
disable the output, the PC port must be pulled lower than 2.4 V,
referenced to -In. Optocouplers, open collector transistors or relays
can be used to control the PC port. Once disabled, 14 V must be
re-applied to the VC port to restart the VTM.
Primary Auxiliary Supply – The PC port can source up to 2.4 mA
at 5 Vdc.
Figure 9—VTM pin configuration
+OUT/-OUT DC Voltage Output Ports
The output and output return are through two sets of contact
locations. The respective +Out and –Out groups must be connected in
parallel with as low an interconnect resistance as possible. Within the
specified input voltage range, the Level 1 DC behavioral model shown
in Figure 17 defines the output voltage of the VTM. The current source
capability of the VTM is shown in the specification table.
To take full advantage of the VTM, the user should note the low output
impedance of the device. The low output impedance provides fast
transient response without the need for bulk POL capacitance. Limited-
life electrolytic capacitors required with conventional converters can be
reduced or even eliminated, saving cost and valuable board real estate.
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048F040T050
Rev. 1.1
Page 5 of 13

5 Page

V048F040M050 arduino
Application Note (continued)
PRELIMINARY
V•I Chip soldering recommendations
V•I Chip modules are intended for reflow soldering processes. The
following information defines the processing conditions required for
successful attachment of a V•I Chip to a PCB. Failure to follow the
recommendations provided can result in aesthetic or functional failure
of the module.
Storage
V•I Chip modules are currently rated at MSL 5. Exposure to ambient
conditions for more than 48 hours requires a 24 hour bake at 125ºC to
remove moisture from the package.
Removal and rework
V•I Chip modules can be removed from PCBs using special tools such
as those made by Air-Vac. These tools heat a very localized region of
the board with a hot gas while applying a tensile force to the
component (using vacuum). Prior to component heating and removal,
the entire board should be heated to 80-100ºC to decrease the
component heating time as well as local PCB warping. If there are
adjacent moisture-sensitive components, a 125ºC bake should be used
prior to component removal to prevent popcorning. V•I Chip modules
should not be expected to survive a removal operation.
Solder paste stencil design
Solder paste is recommended for a number of reasons, including
overcoming minor solder sphere co-planarity issues as well as simpler
integration into overall SMD process.
63/37 SnPb, either no-clean or water-washable, solder paste should be
used. Pb-free development is underway.
The recommended stencil thickness is 6 mils. The apertures should be
0.9-0.9:1.
Pick and place
Modules should be placed within ±5 mils.to maintain placement
position, the modules should not be subjected to acceleration greater
than 500 in/sec2 prior to reflow.
Reflow
There are two temperatures critical to the reflow process; the solder
joint temperature and the module’s case temperature. The solder joint’s
temperature should reach at least 220ºC, with a time above liquidus
(183ºC) of ~30 seconds.
The module’s case temperature must not exceed 208 ºC at anytime
during reflow.
Because of the ΔT needed between the pin and the case, a forced-air
convection oven is preferred for reflow soldering. This reflow method
generally transfers heat from the PCB to the solder joint. The module’s
large mass also reduces its temperature rise. Care should be taken to
prevent smaller devices from excessive temperatures. Reflow of
modules onto a PCB using Air-Vac-type equipment is not recommended
due to the high temperature the module will experience.
239
183
165
degC
91
Joint Temperature, 220ºC
Case Temperature, 208ºC
16
Soldering Time
Figure 21 — Thermal profile diagram
Inspection
The solder joints should conform to IPC 12.2
• Properly wetted fillet must be evident.
• Heel fillet height must exceed lead thickness plus solder thickness.
Figure 22 — Properly reflowed V•I Chip J-Lead
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048F040T050
Rev. 1.1
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