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(V048x020T080) Voltage Transformation Module - Vicor Corporation

Número de pieza V048F020T080
Descripción (V048x020T080) Voltage Transformation Module
Fabricantes Vicor Corporation 
Logotipo Vicor Corporation Logotipo
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V048F020T080 datasheet

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V048F020T080 pdf
Specifications, continued
THERMAL
Symbol
RθJC
RθJB
RθJA
RθJA
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient 1
Junction-to-ambient 2
Min
125
Typ Max
Unit
130 135
°C
0.61 Ws/°C
1.1 °C/W
2.1 °C/W
6.5 °C/W
5.0 °C/W
Notes
1. V048K020T080 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
2. V048K020T080 with a 0.25"H heatsink surface mounted on FR4 board, 300 LFM.
Note
Junction temperature
V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS
Test
High Temperature Operational Life (HTOL)
P R E L I M I N A RYTemperaturecycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 5
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Electro static discharge testing – machine model
EIA/JESD22-A115-A
Meets or exceeds 200 Volts
Highly Accelerated Life Testing (HALT)
Per Vicor Internal
Test Specification*
Operation limits verified, destruct margin determined
Dynamic cycling
Per Vicor internal
test specification*
Constant line, 0-100% load, -20°C to 125°C
* For details of the test protocols see Vicor’s website.
V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION
Test
BGA solder fatigue evaluation
Solder ball shear test
Standard
IPC-9701
IPC-SM-785
IPC-9701
Environment
Cycle condition: TC3 (-40 to +125°C)
Test duration: NTC-B (500 failure free cycles)
Failure through bulk solder or copper pad lift-off
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module V048K020T080 Rev. 1.2
Page 5 of 15

5 Page

V048F020T080 arduino
Configuration Options (Cont.)
PRELIMINARY
F1
7A
Fuse
Input reflected ripple
measurement point
C1
100 µF
Al electrolytic
C2
0.47 µF
ceramic
14 V +–
Figure 16—VTM test circuit
+Out
+In
-Out
TM
VC
VTM
PC
+Out
K
Ro-In
-Out
+
Temperature Monitor
+
C3
100 µF
15 m
Load
Notes:
C3 should be placed close to the load
Application Note
Parallel Operation
In applications requiring higher current or redundancy, VTMs
can be operated in parallel without adding control circuitry or
signal lines. To maximize current sharing accuracy, it is imperative
that the source and load impedance on each VTM in a parallel
array be equal. If VTMs are being fed by an upstream PRM, the
VC nodes of all VTMs must be connectd to the PRM VC.
To achieve matched impedances, dedicated power planes
within the PC board should be used for the output and output
return paths to the array of paralleled VTMs. This technique is
preferable to using traces of varying size and length.
The VTM power train and control architecture allow bi-directional
power transfer when the VTM is operating within its specified
ranges. Bi-directional power processing improves transient
response in the event of an output load dump. The VTM may
operate in reverse, returning output power back to the input
source. It does so efficiently.
Thermal Management
The high efficiency of the VTM results in low power
dissipation minimizing temperature rise, even at full output
current. The heat generated within the internal semiconductor
junctions is coupled through very low thermal resistances, RθJC
and RθJB (see Figure 17), to the PC board allowing flexible
thermal management.
CASE 1 Convection via optional heatsink to air
In an environment with forced convection over the surface
of a PCB with 0.4" of headroom, a VTM with a 0.25 heat sink
offers a simple thermal management option. The total
Junction toAmbient thermal resistance of a surface mounted
V048K020T080 with a heat sink attached is 4.8 ºC/W in
300 LFMairflow, (see Figure 18).
At 2 Vout and full rated current (80A), the VTM dissipates
approximately 12 W per Figure 4. This results in a temperature
rise of approximately 56 ºC, allowing operation in an air
temperature of 69 ºC without exceeding the 125 ºC max
junction temperature.
CASE 2 Conduction via the PC board to air
The low Junction to BGA thermal resistance allows the use
of the PC board as a means of removing heat from the VTM.
Convection from the PC board to ambient, or conduction to a
cold plate, enable flexible thermal management options.
With a VTM mounted on a 2.0 in2 area of a multi-layer PC
board with appropriate power planes resulting in 8 oz of
effective copper weight, the Junction-to-BGA thermal
resistance, RθJA, is 6.5 ºC/W in 300 LFM of air. With a
maximum junction temperature of 125 ºC and 12 W of
dissipation at full current of 80 A, the resulting temperature
rise of 76 ºC allows the VTM to operate at full rated current
up to a 49 ºC ambient temperature. See thermal resistances
on page 9 for additional details on this thermal management option.
Adding low-profile heat sinks to the PC board can lower the
thermal resistance of the PC board surrounding the VTM.
Additional cooling may be added by coupling a cold plate to
the PC board with low thermal resistance stand offs.
CASE 3 Combined direct convection to the air and conduction
to the PC board.
A combination of cooling techniques that utilize the power
planes and dissipation to the air will also reduce the total
thermal impedance. This is the most effective cooling
method. To estimate the total effect of the combination, treat
each cooling branch as one leg of a parallel resistor network.
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module V048K020T080 Rev. 1.2 Page 10 of 15

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