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Número de pieza | B033 | |
Descripción | 1.0 Amp Low Dropout Voltage Regulator | |
Fabricantes | Bay Linear | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de B033 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
No Preview Available ! Bay Linear
Inspire the Linear Power
1.0Amp Low Dropout Voltage Regulator
Adjustable & Fix (0.40Volt Dropout)
B033
Description
The Bay Linear B033 is a three terminal positive NPN
regulator offered as adjustable or fix voltages of 1.8V, 2.5V,
3.0V, 3.3V, and 5Volts. The output current has a capability up
to 1.0Amp,. This device has been optimized for low voltage
where transient response and minimum input voltage are
critical. The 2.85V version is designed specifically to be used
in active terminators for SCSI bus.
Current limit is trimmed to ensure specified output current and
controlled short-circuit current. On-Chip thermal limiting
provides protection against any combination of overload and
ambient temperatures that would create excessive junction
temperatures.
The B033 is offered in a 3-pin SOT-223, and TO-252 (DPAK)
packages compatible with other 3 terminal regulators. 5-pin
version in TO-263 with lower dropout of 0.4 volt is
available.
Features
• Adjustable Output Down to 1.2V
• Output Current of 1.0Amp
• Low Dropout 1.0V for B033
• Dropout of 0.40 V in for B033A
• Adjustable & Fix 1.8V, 2.5V, 3.0V, 3.3V,
5.0V
• Current & Thermal Limiting
• Lower Cost SOT-89 Package
• Available in SOT-223, and TO-252, &
TO-263
• Similar to industry BAOOT/FP
Applications
• Active SCSI terminators
• High efficiency Linear Regulator
• Post regulators fro Switching Supplies
• Battery Charger
• 5V to 3.3V linear Regulators
• Motherboard Clock Supplies
Pin Connection
TO-252
1 23
Vcc GND Vout
Front View
SOT -223
Tab VGND
Adj/GVNCCD OGUNTD IONUT
Front View
Ordering Information
Devices
B033D-X
B033N-X
B033T-X
B033S-X
Package
TO-252
TO-223
TO-220
TO-263
Temp.
0 °C to 125 °C
0 °C to 125 °C
0 °C to 125 °C
0 °C to 125 °C
SOT -223-5
Tab V OUT
1234 5
Front View
#1 Sense
#2 Adj/GND
#3 OUT
#4 Control
#5 VIN
5 VPOWER
4 VCONTROL
3 OUTPUT
2 ADJ/GND.
1 SENSE
TO-263-5 Package
Bay Linear, Inc 2418 Armstrong Street, Livermore, CA 94550 Tel: (925) 606-5950, Fax: (925) 940-9556
www.baylinear.com
1 page APPLICATION NOTES EXTERNAL
CAPACITOR
To ensure the stability of the B033 an output capacitor of at
least 10µF (tantalum)or 50µF (aluminum) is required. The
value may change based on the application requirements on
the output load or temperature range. The capacitor
equivalent series resistance (ESR) will effect the B033
stability. The value of ESR can vary from the type of
capacitor used in the applications. The recommended value
for ESR is 0.5Ω. The output capacitance could increase in
size to above the minimum value. The larger value of
output capacitance as high as 100µF can improve the load
transient response.
SOLDERING METHODS
The B033 SOT-223 package is designed to be compatible
with infrared reflow or vapor-phase reflow soldering
techniques. During soldering the non-active or mildly active
fluxes may be used. The B033 die is attached to the heat
sink lead which exits opposite the input, output, and ground
pins.
Hand soldering and wave soldering should be avoided since
these methods can cause damage to the device with
excessive thermal gradients on the package. The SOT-223
recommended soldering method are as follows: vapor phase
reflow and infrared reflow with the component preheated to
within 65°C of the soldering temperature range.
THERMAL CHARACTERISTICS
The thermal resistance of B033 is 15°C/W from junction to
tab and 31 °C/W from tab to ambient for a total of 46 °C/W
from junction to ambient. The B033 features the internal
thermal limiting to protect the device during overload
conditions. Special care needs to be taken during continues
load conditions the maximum junction temperature does not
exceed 125 °C.
Taking the FR-4 printed circuit board and 1/16 thick with 1
ounce copper foil as an experiment (fig.1 & fig.2), the PCB
material is effective at transmitting heat with the tab
attached to the pad area and a ground plane layer on the
backside of the substrate. Refer to table 1 for the results of
the experiment.
The thermal interaction from other components in the
application can effect the thermal resistance of the B033.
The actual thermal resistance can be determined with
experimentation. B033 power dissipation is calculated as
follows:
PD = (VIN - VOUT)(IOUT)
B033
Maximum Junction Temperature range:
TJ = Tambient (max) + PD* thermal resistance (Junction-to-
ambient)
Maximum Junction temperature must not exceed the
125°C.
PO = (10V - 2.85)(105mA) = (7.15)(105mA) = 750mW
50 X 50 mm
35 X 17 mm
16 X 10 mm
Substrate Layout for SOT-223
Bay Linear, Inc 2418 Armstrong Street, Livermore, CA 94550 Tel: (925) 606-5950, Fax: (925) 940-9556
www.baylinear.com
5 Page |
Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet B033.PDF ] |
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